Intel® MAX® 10 FPGA Signal Integrity Design Guidelines

Download PDF
ID 683572
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines x
Definitions Understanding SSN Guidelines: Clock and Asynchronous Control Input Signal Guidelines: Data Input Pin Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package Guidelines: I/O Restriction Rules Guidelines: Placement Restrictions for 1.0 V I/O Pin Guidelines: Analog-to-Digital Converter I/O Restriction Guidelines: Voltage-Referenced I/O Standards Restriction Guidelines: Adhere to the LVDS I/O Restrictions Rules Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers Guidelines: External Memory Interface I/O Restrictions Guidelines: ADC Ground Plane Connection Guidelines: Board Design for ADC Reference Voltage Pin Guidelines: Board Design for Analog Input Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND) Guidelines: Intel® MAX® 10 Board Design Requirement for DDR2, DDR3, and LPDDR2 Document Revision History for Intel® MAX® 10 FPGA Signal Integrity Design Guidelines
Guidelines: Clock and Asynchronous Control Input Signal x
Schmitt-Trigger Input Buffer
Guidelines: Placement Restrictions for 1.0 V I/O Pin x
Calculating the Total Inductance for 1.0 V Pin Placement
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines

Intel® MAX® 10 FPGA Signal Integrity Design Guidelines

Today’s complex FPGA system design is incomplete without addressing the integrity of signals coming in to and out of the FPGA. Simultaneous switching noise (SSN) often leads to the degradation of signal integrity by causing signal distortion, thereby reducing the noise margin of a system.

To avoid signal integrity issues, Intel recommends that you follow the design considerations, I/O placement guidelines, and board design guidelines for Intel® MAX® 10 devices regarding:

  • I/O placement rules
  • Voltage-referenced I/O standards
  • High-speed LVDS, phase-locked loops (PLLs), and clocking
  • External memory interfaces
  • Analog to digital converter

Intel recommends that you perform SSN analysis early in your FPGA design, before the layout of your PCB.


Section Content
Definitions
Understanding SSN
Guidelines: Clock and Asynchronous Control Input Signal
Guidelines: Data Input Pin
Guidelines: Clock and Data Input Signal for Intel MAX 10 E144 Package
Guidelines: I/O Restriction Rules
Guidelines: Placement Restrictions for 1.0 V I/O Pin
Guidelines: Analog-to-Digital Converter I/O Restriction
Guidelines: Voltage-Referenced I/O Standards Restriction
Guidelines: Adhere to the LVDS I/O Restrictions Rules
Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers
Guidelines: External Memory Interface I/O Restrictions
Guidelines: ADC Ground Plane Connection
Guidelines: Board Design for ADC Reference Voltage Pin
Guidelines: Board Design for Analog Input
Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND)
Guidelines: Intel MAX 10 Board Design Requirement for DDR2, DDR3, and LPDDR2
Document Revision History for Intel MAX 10 FPGA Signal Integrity Design Guidelines

Level Two Title