Visible to Intel only — GUID: sam1438590235507
Ixiasoft
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Stratix® 10 GX 400 and SX 400
Visible to Intel only — GUID: sam1438590235507
Ixiasoft
2. Stratix® 10 I/O Architecture and Features
The I/O system of Stratix® 10 devices supports various I/O standards. In Stratix® 10 devices, the I/O pins are located in I/O banks. The I/O pins and I/O buffers have several programmable features.
The Stratix® 10 I/Os support the following features:
- Single-ended, non-voltage-referenced, and voltage-referenced I/O standards
- Low-voltage differential signaling (LVDS), RSDS, mini-LVDS, HSTL, HSUL, SSTL, and POD I/O standards
- Serializer/deserializer (SERDES)
- Programmable output current strength
- Programmable slew rate
- Programmable bus-hold
- Programmable weak pull-up resistor
- Programmable pre-emphasis for DDR4 and the LVDS output buffer
- Programmable I/O delay
- Programmable differential output voltage (VOD)
- Programmable open-drain output
- On-chip series termination (RS OCT) with and without calibration
- On-chip parallel termination (RT OCT)
- On-chip differential termination (RD OCT)
- HSTL and SSTL input buffer with dynamic power down
- Dynamic on-chip parallel termination for all I/O banks
- Internally generated VREF with DDR4 calibration
Note: The information in this chapter is applicable to all Stratix® 10 variants, unless noted otherwise.