Visible to Intel only — GUID: sam1438844038251
Ixiasoft
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Stratix® 10 GX 400 and SX 400
Visible to Intel only — GUID: sam1438844038251
Ixiasoft
1.2. Stratix® 10 I/O Migration Support
- In the following figures, the arrows indicate the migration paths. The devices included in each migration path are shaded.
- If the line connects two different columns, you can migrate between different packages of the product lines. However, different ordering part number of the product lines may have different LE count, transceiver count, or HBM features.
- To achieve the full I/O migration across product lines in the same migration path, restrict I/Os and transceivers usage to match the product line with the lowest I/O and transceiver counts.
Figure 1. Migration Capability Across Stratix® 10 GX and SX Product Lines—Preliminary
Figure 2. Migration Capability Across Stratix® 10 TX Product Lines—Preliminary
Figure 3. Migration Capability Across Stratix® 10 MX Product Lines—Preliminary
Figure 4. Migration Capability Across Stratix® 10 DX Product Lines—Preliminary
Note: To verify the pin migration compatibility, use the Pin Migration View window in the Quartus® Prime software Pin Planner.