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3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Stratix® 10 GX 400 and SX 400
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2.4.4. Dynamic OCT
Dynamic OCT is useful for terminating a high-performance bidirectional path by optimizing the signal integrity depending on the direction of the data. Dynamic OCT also helps save power because device termination is internal. Internal termination switches on only during input operation and thus draws less static power.
Note: If you use the SSTL-15, SSTL-135, and SSTL-125 I/O standards with the DDR3 memory interface, Altera recommends that you use OCT with these I/O standards to save board space and cost. OCT reduces the number of external termination resistors used.
Dynamic OCT | Bidirectional I/O | State |
---|---|---|
Dynamic RT OCT | Acts as a receiver | Enabled |
Acts as a driver | Disabled | |
Dynamic RS OCT | Acts as a receiver | Disabled |
Acts as a driver | Enabled |
Figure 13. Dynamic RT OCT in Stratix® 10 Devices
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