Stratix® 10 General Purpose I/O User Guide

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ID 683518
Date 10/07/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 I/O Overview 2. Stratix® 10 I/O Architecture and Features 3. Stratix® 10 I/O Design Considerations 4. Stratix® 10 I/O Implementation Guides 5. GPIO Intel® FPGA IP Reference 6. Document Revision History for the Stratix® 10 General Purpose I/O User Guide
1. Stratix® 10 I/O Overview x
1.1. Stratix® 10 I/O and Differential I/O Buffers 1.2. Stratix® 10 I/O Migration Support
2. Stratix® 10 I/O Architecture and Features x
2.1. I/O Standards and Voltage Levels in Stratix® 10 Devices 2.2. I/O Element Structure in Stratix® 10 Devices 2.3. Programmable IOE Features in Stratix® 10 Devices 2.4. On-Chip I/O Termination in Stratix® 10 Devices 2.5. External I/O Termination for Stratix® 10 Devices
2.1. I/O Standards and Voltage Levels in Stratix® 10 Devices x
2.1.1. Stratix® 10 I/O Standards Support 2.1.2. Stratix® 10 I/O Standards Voltage Support
2.2. I/O Element Structure in Stratix® 10 Devices x
2.2.1. I/O Bank Architecture in Stratix® 10 Devices 2.2.2. I/O Buffer and Registers in Stratix® 10 Devices
2.3. Programmable IOE Features in Stratix® 10 Devices x
2.3.1. Programmable Output Slew Rate Control 2.3.2. Programmable IOE Delay 2.3.3. Programmable Open-Drain Output 2.3.4. Programmable Bus Hold 2.3.5. Programmable Pull-Up Resistor 2.3.6. Programmable Pre-Emphasis 2.3.7. Programmable Differential Output Voltage 2.3.8. Programmable Current Strength
2.4. On-Chip I/O Termination in Stratix® 10 Devices x
2.4.1. RS OCT without Calibration in Stratix® 10 Devices 2.4.2. RS OCT with Calibration in Stratix® 10 Devices 2.4.3. RT OCT with Calibration in Stratix® 10 Devices 2.4.4. Dynamic OCT 2.4.5. Differential Input RD OCT 2.4.6. OCT Calibration Block in Stratix® 10 Devices
2.5. External I/O Termination for Stratix® 10 Devices x
2.5.1. Single-Ended I/O Termination 2.5.2. Differential I/O Termination for Stratix® 10 Devices
2.5.2. Differential I/O Termination for Stratix® 10 Devices x
2.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 2.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 2.5.2.3. LVPECL Termination
3. Stratix® 10 I/O Design Considerations x
3.1. Guideline: VREF Sources and VREF Pins 3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards 3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing 3.5. Guideline: Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down 3.6. Guideline: Maximum DC Current Restrictions 3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks 3.8. Guideline: I/O Standards Limitation for Stratix® 10 TX 400 3.9. Guideline: I/O Standards Limitation for Stratix® 10 GX 400 and SX 400
4. Stratix® 10 I/O Implementation Guides x
4.1. GPIO Intel® FPGA IP 4.2. Verifying Resource Utilization and Design Performance 4.3. GPIO Intel® FPGA IP Timing 4.4. GPIO Intel® FPGA IP Design Examples 4.5. Verifying Pin Migration Compatibility 4.6. IP Migration to the GPIO IP Core
4.1. GPIO Intel® FPGA IP x
4.1.1. Release Information for GPIO Intel® FPGA IP 4.1.2. GPIO Intel® FPGA IP Data Paths 4.1.3. Register Packing
4.1.2. GPIO Intel® FPGA IP Data Paths x
4.1.2.1. Input Path 4.1.2.2. Output and Output Enable Paths
4.3. GPIO Intel® FPGA IP Timing x
4.3.1. Timing Components 4.3.2. Delay Elements 4.3.3. Timing Analysis 4.3.4. Timing Closure Guidelines
4.3.3. Timing Analysis x
4.3.3.1. Single Data Rate Input Register 4.3.3.2. Full-Rate or Half-Rate DDIO Input Register 4.3.3.3. Single Data Rate Output Register 4.3.3.4. Full-Rate or Half-Rate DDIO Output Register
4.4. GPIO Intel® FPGA IP Design Examples x
4.4.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 4.4.2. GPIO Intel® FPGA IP Simulation Design Example
4.6. IP Migration to the GPIO IP Core x
4.6.1. Migrating Your ALTDDIO_IN, ALTDDIO_OUT, ALTDDIO_BIDIR, and ALTIOBUF IP Cores 4.6.2. Guideline: Swap datain_h and datain_l Ports in Migrated IP
5. GPIO Intel® FPGA IP Reference x
5.1. GPIO Intel® FPGA IP Parameter Settings 5.2. GPIO Intel® FPGA IP Interface Signals
5.2. GPIO Intel® FPGA IP Interface Signals x
5.2.1. Shared Signals 5.2.2. Data Bit-Order for Data Interface 5.2.3. Data Interface Signals and Corresponding Clocks
1. Stratix® 10 I/O Overview
2. Stratix® 10 I/O Architecture and Features
3. Stratix® 10 I/O Design Considerations
4. Stratix® 10 I/O Implementation Guides
5. GPIO Intel® FPGA IP Reference
6. Document Revision History for the Stratix® 10 General Purpose I/O User Guide

4.1.2.2. Output and Output Enable Paths

The output delay element sends data to the pad through the output buffer.

Each LVDS I/O output path contains two stages of DDIOs, which are half-rate and full-rate.

The 3 V I/Os do not support DDIOs.

Figure 28. Simplified View of Single-Ended GPIO Output Path


Figure 29. Output Path Waveform in DDIO Mode with Half-Rate Conversion
Figure 30.  Simplified View of Output Enable Path


The difference between the output path and output enable (OE) path is that the OE path does not contain full-rate DDIO. To support packed-register implementations in the OE path, a simple register operates as full-rate DDIO. For the same reason, only one half-rate DDIO is present.

The OE path operates in the following three fundamental modes:

  • Bypass—the core sends data directly to the delay element, bypassing all DDIOs.
  • Packed Register—bypasses half-rate DDIO.
  • SDR output at half-rate—half-rate DDIOs convert data from full-rate to half-rate.

In Stratix® 10 devices, each 3 V I/O bank supports only two output enables (OE) for its eight single-ended I/Os.

Note: The GPIO Intel® FPGA IP and OCT Intel® FPGA IP support OCT during power up and user mode on single-directional input or output pins. The GPIO IP does not support dynamic OCT of bidirectional pins. For applications that require dynamic OCT control for bidirectional pins, refer to the related information.
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