Stratix® 10 General Purpose I/O User Guide

Download PDF
ID 683518
Date 10/07/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 I/O Overview 2. Stratix® 10 I/O Architecture and Features 3. Stratix® 10 I/O Design Considerations 4. Stratix® 10 I/O Implementation Guides 5. GPIO Intel® FPGA IP Reference 6. Document Revision History for the Stratix® 10 General Purpose I/O User Guide
1. Stratix® 10 I/O Overview x
1.1. Stratix® 10 I/O and Differential I/O Buffers 1.2. Stratix® 10 I/O Migration Support
2. Stratix® 10 I/O Architecture and Features x
2.1. I/O Standards and Voltage Levels in Stratix® 10 Devices 2.2. I/O Element Structure in Stratix® 10 Devices 2.3. Programmable IOE Features in Stratix® 10 Devices 2.4. On-Chip I/O Termination in Stratix® 10 Devices 2.5. External I/O Termination for Stratix® 10 Devices
2.1. I/O Standards and Voltage Levels in Stratix® 10 Devices x
2.1.1. Stratix® 10 I/O Standards Support 2.1.2. Stratix® 10 I/O Standards Voltage Support
2.2. I/O Element Structure in Stratix® 10 Devices x
2.2.1. I/O Bank Architecture in Stratix® 10 Devices 2.2.2. I/O Buffer and Registers in Stratix® 10 Devices
2.3. Programmable IOE Features in Stratix® 10 Devices x
2.3.1. Programmable Output Slew Rate Control 2.3.2. Programmable IOE Delay 2.3.3. Programmable Open-Drain Output 2.3.4. Programmable Bus Hold 2.3.5. Programmable Pull-Up Resistor 2.3.6. Programmable Pre-Emphasis 2.3.7. Programmable Differential Output Voltage 2.3.8. Programmable Current Strength
2.4. On-Chip I/O Termination in Stratix® 10 Devices x
2.4.1. RS OCT without Calibration in Stratix® 10 Devices 2.4.2. RS OCT with Calibration in Stratix® 10 Devices 2.4.3. RT OCT with Calibration in Stratix® 10 Devices 2.4.4. Dynamic OCT 2.4.5. Differential Input RD OCT 2.4.6. OCT Calibration Block in Stratix® 10 Devices
2.5. External I/O Termination for Stratix® 10 Devices x
2.5.1. Single-Ended I/O Termination 2.5.2. Differential I/O Termination for Stratix® 10 Devices
2.5.2. Differential I/O Termination for Stratix® 10 Devices x
2.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 2.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 2.5.2.3. LVPECL Termination
3. Stratix® 10 I/O Design Considerations x
3.1. Guideline: VREF Sources and VREF Pins 3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards 3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing 3.5. Guideline: Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down 3.6. Guideline: Maximum DC Current Restrictions 3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks 3.8. Guideline: I/O Standards Limitation for Stratix® 10 TX 400 3.9. Guideline: I/O Standards Limitation for Stratix® 10 GX 400 and SX 400
4. Stratix® 10 I/O Implementation Guides x
4.1. GPIO Intel® FPGA IP 4.2. Verifying Resource Utilization and Design Performance 4.3. GPIO Intel® FPGA IP Timing 4.4. GPIO Intel® FPGA IP Design Examples 4.5. Verifying Pin Migration Compatibility 4.6. IP Migration to the GPIO IP Core
4.1. GPIO Intel® FPGA IP x
4.1.1. Release Information for GPIO Intel® FPGA IP 4.1.2. GPIO Intel® FPGA IP Data Paths 4.1.3. Register Packing
4.1.2. GPIO Intel® FPGA IP Data Paths x
4.1.2.1. Input Path 4.1.2.2. Output and Output Enable Paths
4.3. GPIO Intel® FPGA IP Timing x
4.3.1. Timing Components 4.3.2. Delay Elements 4.3.3. Timing Analysis 4.3.4. Timing Closure Guidelines
4.3.3. Timing Analysis x
4.3.3.1. Single Data Rate Input Register 4.3.3.2. Full-Rate or Half-Rate DDIO Input Register 4.3.3.3. Single Data Rate Output Register 4.3.3.4. Full-Rate or Half-Rate DDIO Output Register
4.4. GPIO Intel® FPGA IP Design Examples x
4.4.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 4.4.2. GPIO Intel® FPGA IP Simulation Design Example
4.6. IP Migration to the GPIO IP Core x
4.6.1. Migrating Your ALTDDIO_IN, ALTDDIO_OUT, ALTDDIO_BIDIR, and ALTIOBUF IP Cores 4.6.2. Guideline: Swap datain_h and datain_l Ports in Migrated IP
5. GPIO Intel® FPGA IP Reference x
5.1. GPIO Intel® FPGA IP Parameter Settings 5.2. GPIO Intel® FPGA IP Interface Signals
5.2. GPIO Intel® FPGA IP Interface Signals x
5.2.1. Shared Signals 5.2.2. Data Bit-Order for Data Interface 5.2.3. Data Interface Signals and Corresponding Clocks
1. Stratix® 10 I/O Overview
2. Stratix® 10 I/O Architecture and Features
3. Stratix® 10 I/O Design Considerations
4. Stratix® 10 I/O Implementation Guides
5. GPIO Intel® FPGA IP Reference
6. Document Revision History for the Stratix® 10 General Purpose I/O User Guide

2.4. On-Chip I/O Termination in Stratix® 10 Devices

Serial (RS) and parallel (RT) OCT provides I/O impedance matching and termination capabilities. OCT maintains signal quality, saves board space, and reduces external component costs.

The Stratix® 10 devices support OCT in all FPGA I/O banks with the following exceptions:
  • The 3 V I/Os support only OCT without calibration.
  • The 3.3 V I/Os do not support OCT.
Figure 9. Single-ended Termination (RS and RT) This figure shows the single-ended termination schemes supported in Stratix® 10 devices. RT1 and RT2 are dynamic parallel terminations and are enabled only if the device is receiving. In bidirectional applications, RT1 and RT2 are automatically switched on when the device is receiving and switched off when the device is driving.


Table 9.  OCT Schemes Supported in Stratix® 10 Devices
Direction OCT Schemes I/O Type Support
LVDS I/O 3 V I/O 3.3 V I/O
Output RS OCT with calibration Yes — —
RS OCT without calibration Yes Yes —
Input RT OCT with calibration Yes — —
RD OCT (LVDS I/O standard only) Yes — —
Bidirectional Dynamic RS and RT OCT Yes — —

Section Content
RS OCT without Calibration in Stratix 10 Devices
RS OCT with Calibration in Stratix 10 Devices
RT OCT with Calibration in Stratix 10 Devices
Dynamic OCT
Differential Input RD OCT
OCT Calibration Block in Stratix 10 Devices

Level Two Title