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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
- During device power up and device configuration, all GPIO pins are tri-stated with weak pull-up enabled.
- During device power down, all I/O pins are in undetermined state and the pin signal is measured between GND and the VCCIO level.
- At any point,the input signal sof an I/O pin must not exceed the maximum DC input voltage specified in the device datasheet.
Figure 24. Intel® Stratix® 10 I/O Buffers Behavior