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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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2.3.1. Programmable Output Slew Rate Control
You can specify the slew rate on a pin-by-pin basis because each I/O pin contains a slew rate control. The slew rate control affects both the rising and falling edges.
You can select between two slew rate settings, 1 and 0:
- Fast slew rate (1)—provides high-speed transitions for high-performance systems. This is the default setting. If you enable on-chip termination (OCT), this setting is always used.
- Slow slew rate (0)—reduces system noise and crosstalk but adds a nominal delay to the rising and falling edges.
Note: Intel recommends that you perform IBIS or SPICE simulations to determine the best slew rate setting for your specific application.