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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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2.5.2.2. LVDS, RSDS, and Mini-LVDS Termination
All I/O banks have dedicated circuitry to support the true LVDS, RSDS, and mini-LVDS I/O standards by using true LVDS output buffers without resistor networks.
Figure 21. LVDS I/O Standard TerminationThis figure shows the LVDS I/O standard termination. The on-chip differential resistor is available in all I/O banks.