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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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3. Intel® Stratix® 10 I/O Design Considerations
There are several considerations that require your attention to ensure the success of your designs. Unless noted otherwise, these design guidelines apply to all variants of this device family.
Section Content
Guideline: VREF Sources and VREF Pins
Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
Guideline: Do Not Drive I/O Pins During Power Sequencing
Guideline: Intel Stratix 10 I/O Buffer During Power Up, Configuration, and Power Down
Guideline: Maximum DC Current Restrictions
Guideline: Use Only One Voltage for All 3 V I/O Banks
Guideline: I/O Standards Limitation for Intel Stratix 10 TX 400
Guideline: I/O Standards Limitation for Intel Stratix 10 GX 400 and SX 400