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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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2.4.5. Differential Input RD OCT
All I/O pins and dedicated clock input pins in Intel® Stratix® 10 devices support on-chip differential termination, RD OCT. The Intel® Stratix® 10 devices provide a 100 Ω, on-chip differential termination option on each differential receiver channel for LVDS standards.
You can enable on-chip termination in the Intel® Quartus® Prime software Assignment Editor.
Figure 14. On-Chip Differential I/O Termination
Field | Assignment |
---|---|
To | rx_in |
Assignment name | Input Termination |
Value | Differential |