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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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5.2.2. Data Bit-Order for Data Interface
Figure 40. Data Bit-Order ConventionThis figure shows the bit-order convention for the din, dout and oe data signals.
- If the data bus size value is SIZE, the LSB is at the right-most position.
- If the data bus size value is 2 × SIZE, the bus is made of two words of SIZE.
- If the data bus size value is 4 × SIZE, the bus is made of four words of SIZE.
- The LSB is in the right-most position of each word.
- The right-most word specifies the first word going out for output buses and the first word coming in for input buses.
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