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1.1. Key Advantages of Arria® V Devices
1.2. Summary of Arria® V Features
1.3. Arria® V Device Variants and Packages
1.4. I/O Vertical Migration for Arria® V Devices
1.5. Adaptive Logic Module
1.6. Variable-Precision DSP Block
1.7. Embedded Memory Blocks
1.8. Clock Networks and PLL Clock Sources
1.9. FPGA General Purpose I/O
1.10. PCIe* Gen1, Gen2, and Gen 3 Hard IP
1.11. External Memory Interface
1.12. Low-Power Serial Transceivers
1.13. SoC with HPS
1.14. Dynamic Reconfiguration
1.15. Enhanced Configuration and Configuration via Protocol
1.16. Power Management
1.17. Document Revision History
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1.12.1. Transceiver Channels
The transceivers are positioned on the left and right outer edges of the device. The transceiver channels consist of the physical medium attachment (PMA), physical coding sublayer (PCS), and clock networks.
The following figures are graphical representations of a top view of the silicon die, which corresponds to a reverse view for flip chip packages. Different Arria V devices may have different floorplans than the ones shown in the figures.
Figure 9. Device Chip Overview for Arria V GX and GT Devices
Figure 10. Device Chip Overview for Arria V GZ Devices
Figure 11. Device Chip Overview for Arria V SX and ST Devices