Technology |
- TSMC's 20-nm SoC process technology
- Allows operation at a lower VCC level of 0.82 V instead of the 0.9 V standard VCC core voltage
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Packaging |
- 1.0 mm ball-pitch Fineline BGA packaging
- 0.8 mm ball-pitch Ultra Fineline BGA packaging
- Multiple devices with identical package footprints for seamless migration between different FPGA densities
- Devices with compatible package footprints allow migration to next generation high-end Stratix® 10 devices
- RoHS, leaded1, and lead-free (Pb-free) options
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High-performance FPGA fabric |
- Enhanced 8-input ALM with four registers
- Improved multi-track routing architecture to reduce congestion and improve compilation time
- Hierarchical core clocking architecture
- Fine-grained partial reconfiguration
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Internal memory blocks |
- M20K—20-Kb memory blocks with hard error correction code (ECC)
- Memory logic array block (MLAB)—640-bit memory
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Embedded Hard IP blocks |
Variable-precision DSP |
- Native support for signal processing precision levels from 18 x 19 to 54 x 54
- Native support for 27 x 27 multiplier mode
- 64-bit accumulator and cascade for systolic finite impulse responses (FIRs)
- Internal coefficient memory banks
- Preadder/subtractor for improved efficiency
- Additional pipeline register to increase performance and reduce power
- Supports floating point arithmetic:
- Perform multiplication, addition, subtraction, multiply-add, multiply-subtract, and complex multiplication.
- Supports multiplication with accumulation capability, cascade summation, and cascade subtraction capability.
- Dynamic accumulator reset control.
- Support direct vector dot and complex multiplication chaining multiply floating point DSP blocks.
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Memory controller |
DDR4, DDR3, and DDR3L |
PCI Express* |
PCI Express (PCIe*) Gen3 (x1, x2, x4, or x8), Gen2 (x1, x2, x4, or x8) and Gen1 (x1, x2, x4, or x8) hard IP with complete protocol stack, endpoint, and root port |
Transceiver I/O |
- 10GBASE-KR/40GBASE-KR4 Forward Error Correction (FEC)
- PCS hard IPs that support:
- 10-Gbps Ethernet (10GbE)
- PCIe PIPE interface
- Interlaken
- Gbps Ethernet (GbE)
- Common Public Radio Interface (CPRI) with deterministic latency support
- Gigabit-capable passive optical network (GPON) with fast lock-time support
- 13.5G JESD204b
- 8B/10B, 64B/66B, 64B/67B encoders and decoders
- Custom mode support for proprietary protocols
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Core clock networks |
- Up to 800 MHz fabric clocking, depending on the application:
- 667 MHz external memory interface clocking with 2,400 Mbps DDR4 interface
- 800 MHz LVDS interface clocking with 1,600 Mbps LVDS interface
- Global, regional, and peripheral clock networks
- Clock networks that are not used can be gated to reduce dynamic power
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Phase-locked loops (PLLs) |
- High-resolution fractional synthesis PLLs:
- Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
- Support integer mode and fractional mode
- Fractional mode support with third-order delta-sigma modulation
- Integer PLLs:
- Adjacent to general purpose I/Os
- Support external memory and LVDS interfaces
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FPGA General-purpose I/Os (GPIOs) |
- 1.6 Gbps LVDS—every pair can be configured as receiver or transmitter
- On-chip termination (OCT)
- 1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfacing
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External Memory Interface |
- Hard memory controller— DDR4, DDR3, and DDR3L support
- DDR4—speeds up to 1,200 MHz/2,400 Mbps
- DDR3—speeds up to 1,067 MHz/2,133 Mbps
- Soft memory controller—provides support for RLDRAM 3 2, QDR IV2, and QDR II+
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Low-power serial transceivers |
- Continuous operating range:
- Intel® Arria® 10 GX—1 Gbps to 17.4 Gbps
- Intel® Arria® 10 GT—1 Gbps to 25.8 Gbps
- Backplane support:
- Intel® Arria® 10 GX—up to 12.5
- Intel® Arria® 10 GT—up to 12.5
- Extended range down to 125 Mbps with oversampling
- ATX transmit PLLs with user-configurable fractional synthesis capability
- Electronic Dispersion Compensation (EDC) support for XFP, SFP+, QSFP, and CFP optical module
- Adaptive linear and decision feedback equalization
- Transmitter pre-emphasis and de-emphasis
- Dynamic partial reconfiguration of individual transceiver channels
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HPS ( Intel® Arria® 10 SX devices only) |
Processor and system |
- Dual-core ARM Cortex-A9 MPCore processor—1.2 GHz CPU with 1.5 GHz overdrive capability
- 256 KB on-chip RAM and 64 KB on-chip ROM
- System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers
- Security features—anti-tamper, secure boot, Advanced Encryption Standard (AES) and authentication (SHA)
- ARM CoreSight* JTAG debug access port, trace port, and on-chip trace storage
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External interfaces |
- Hard memory interface—Hard memory controller (2,400 Mbps DDR4, and 2,133 Mbps DDR3), Quad serial peripheral interface (QSPI) flash controller, NAND flash controller, direct memory access (DMA) controller, Secure Digital/MultiMediaCard (SD/MMC) controller
- Communication interface— 10/100/1000 Ethernet media access control (MAC), USB On-The-GO (OTG) controllers, I2C controllers, UART 16550, serial peripheral interface (SPI), and up to 62 HPS GPIO interfaces (48 direct-share I/Os)
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Interconnects to core |
- High-performance ARM AMBA* AXI bus bridges that support simultaneous read and write
- HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa
- Configuration bridge that allows HPS configuration manager to configure the core logic via dedicated 32-bit configuration port
- FPGA-to-HPS SDRAM controller bridge—provides configuration interfaces for the multiport front end (MPFE) of the HPS SDRAM controller
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Configuration |
- Tamper protection—comprehensive design protection to protect your valuable IP investments
- Enhanced 256-bit advanced encryption standard (AES) design security with authentication
- Configuration via protocol (CvP) using PCIe* Gen1, Gen2, or Gen3
- Dynamic reconfiguration of the transceivers and PLLs
- Fine-grained partial reconfiguration of the core fabric
- Active Serial x4 Interface
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Power management |
- SmartVID
- Low static power device options
- Programmable Power Technology
- Intel® Quartus® Prime integrated power analysis
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Software and tools |
- Intel® Quartus® Prime design suite
- Transceiver toolkit
- Platform Designer system integration tool
- DSP Builder for Intel FPGAs
- OpenCL™ support
- Intel® SoC FPGA Embedded Design Suite (EDS)
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