Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series

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ID 683301
Date 4/07/2025
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Document Table of Contents
Document Table of Contents x
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions E-Tile Transceiver Power Supply Recommended Operating Conditions P-Tile Transceiver Power Supply Recommended Operating Conditions R-Tile Transceiver Power Supply Recommended Operating Conditions F-Tile Transceiver Power Supply Recommended Operating Conditions HPS Power Supply Recommended Operating Conditions
DC Characteristics x
Supply Current and Power Consumption I/O Pin Leakage Current Bus Hold Specifications OCT Calibration Accuracy Specifications OCT Without Calibration Resistance Tolerance Specifications Pin Capacitance Internal Weak Pull-Up Resistor Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
Single-Ended I/O Standards Specifications Single-Ended SSTL, HSTL, HSUL, and POD I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications Differential SSTL, HSTL, and HSUL I/O Standards Specifications Differential POD I/O Standards Specifications Differential I/O Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications E-Tile Transceiver Performance Specifications P-Tile Transceiver Performance Specifications R-Tile Transceiver Performance Specifications F-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported DLL Range Specifications Memory Output Clock Jitter Specifications
E-Tile Transceiver Performance Specifications x
E-Tile Transceiver Performance E-Tile Transceiver Reference Clock Specifications E-Tile Transmitter Specifications E-Tile Receiver Specifications
P-Tile Transceiver Performance Specifications x
P-Tile Transceiver Performance P-Tile Transceiver Reference Clock Specifications P-Tile Transmitter Specifications P-Tile Receiver Specifications
R-Tile Transceiver Performance Specifications x
R-Tile Transceiver Performance R-Tile Transceiver Reference Clock Specifications R-Tile Transmitter Specifications R-Tile Receiver Specifications
F-Tile Transceiver Performance Specifications x
F-Tile Transceiver Performance F-Tile Transceiver Reference Clock Specifications F-Tile Transmitter Specifications F-Tile Receiver Specifications F-Tile Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming (Avalon®-ST) Configuration Timing Configuration Bit Stream Sizes
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series

AS Configuration Timing

Table 99.  AS Timing Parameters

Intel® recommends performing trace length matching for nCSO and AS_DATA pins to AS_CLK to minimize the skew. Refer to the related information to calculate the maximum allowable skew tolerance for nCSO and AS_DATA pins to AS_CLK.

For specification status, see the Data Sheet Status table

Symbol Description Minimum Typical Maximum Unit
Tclk 129 AS_CLK clock period — 6.02 — ns
Tdutycycle AS_CLK duty cycle 45 50 55 %
Tdcsfrs AS_nCSO[3:0] asserted to first AS_CLK edge 8.5130 — — ns
Tdcslst Last AS_CLK edge to AS_nCSO[3:0] deasserted 6.8130 — — ns
Tdo 131 AS_DATA[3:0] output delay –0.6 — 0.6 ns
Text_delay 132 133 Total external propagation delay on AS signals 0 — 13.5 ns
Tdcsb2b Minimum delay of slave select deassertion between two back-to-back transfers 62 — — ns
Figure 28. AS Configuration Serial Output Timing Diagram
Figure 29. AS Configuration Serial Input Timing Diagram
Related Information
129 AS_CLK fMAX has dependency on the maximum board loading. For AS single device configuration or AS using multiple serial flash devices configuration, use the equations in Tdo and Text_delay notes to ensure your board has sufficient timing margin to meet flash setup/hold time specifications and AS timing specifications in this data sheet. For AS using multiple serial flash devices, refer to the related information for the recommended AS_CLK frequency and maximum board loading.
130 AS operating at maximum clock frequency = 166 MHz. The delay is larger when operating at AS clock frequency lower than 166 MHz.
131 Load capacitance for DCLK = 12 pF and AS_DATA = 27 pF. Intel® recommends obtaining the Tdo for a given link (including receiver, transmission lines, connectors, termination resistors, and other components) through IBIS or HSPIC simulation. To analyze flash setup time,
  • Tsu = Tclk/2 - Tdo(max) + Tbd_clk – Tbd_data(max)
  • Tho = Tclk/2 + Tdo(min) – Tbd_clk + Tbd_data(min)
132 Text_delay = Tbd_clk + Tco + Tbd_data + Tadd
  • Tbd_clk: Propagation delay for AS_CLK between FPGA and flash device.
  • Tco: Output hold time and clock low to output valid of flash device. This delay must be used to ensure Text_delay is within the minimum and maximum specification values.
  • Tbd_data: Propagation delay for AS_DATA bus between FPGA and flash device.
  • Tadd: Propagation delay for active/passive components on AS_DATA interfaces.
133 Text_delay specification is based on AS_CLK = 166 MHz. The value can be larger at lower AS_CLK frequency. For more details, refer to the related information.
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