Intel® Quartus® Prime Pro Edition User Guide: Power Analysis and Optimization

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ID 683174
Date 6/22/2022
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Document Table of Contents
Document Table of Contents x
1. Power Analysis 2. Power Optimization 3. Power Analysis and Optimization Document Archive A. Intel® Quartus® Prime Pro Edition User Guides
1. Power Analysis x
1.1. Power Analysis Tools 1.2. Running the Power Analyzer 1.3. Specifying Power Analyzer Input 1.4. Viewing Power Analysis Reports 1.5. Power Analysis in Modular Design Flows 1.6. Scripting Support 1.7. Power Analysis Revision History
1.3. Specifying Power Analyzer Input x
1.3.1. Settings for Power Analysis 1.3.2. Specifying Signal Activity Data 1.3.3. Specifying the Default Toggle Rate 1.3.4. Specifying Toggle Rates for Specific Nodes 1.3.5. Avoiding Simulation Node Name Match
1.3.2. Specifying Signal Activity Data x
1.3.2.1. Using Simulation Signal Activity Data in Power Analysis 1.3.2.2. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation 1.3.2.3. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities 1.3.2.4. Signal Activities from User Defaults Only
1.3.2.1. Using Simulation Signal Activity Data in Power Analysis x
1.3.2.1.1. Generating Signal Activity Data for Power Analysis 1.3.2.1.2. Generating Standard Delay Output for Power Analysis 1.3.2.1.3. Simulation Glitch Filtering
1.3.2.2. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation x
1.3.2.2.1. RTL Simulation Limitation
1.3.4. Specifying Toggle Rates for Specific Nodes x
1.3.4.1. Clock Node Toggle Rates
1.5. Power Analysis in Modular Design Flows x
1.5.1. Complete Design Simulation Power Analysis Flow 1.5.2. Modular Design Simulation Power Analysis Flow 1.5.3. Multiple Simulation Power Analysis Flow 1.5.4. Overlapping Simulation Power Analysis Flow 1.5.5. Partial Design Simulation Power Analysis Flow 1.5.6. Vectorless Estimation Power Analysis Flow
1.5.5. Partial Design Simulation Power Analysis Flow x
1.5.5.1. Specifying Start and End Time for Signal Activity Calculations
1.6. Scripting Support x
1.6.1. Running the Power Analyzer from the Command–Line
2. Power Optimization x
2.1. Factors Affecting Power Consumption 2.2. Design Space Explorer II for Power-Driven Optimization 2.3. Power-Driven Compilation 2.4. Design Guidelines 2.5. Power Optimization Advisor 2.6. Power Optimization Revision History
2.1. Factors Affecting Power Consumption x
2.1.1. Design Activity and Power Analysis 2.1.2. Device Selection 2.1.3. Environmental Conditions 2.1.4. Device Resource Usage 2.1.5. Signal Activity
2.1.4. Device Resource Usage x
2.1.4.1. Number, Type, and Loading of I/O Pins 2.1.4.2. Number and Type of Hard Logic Blocks 2.1.4.3. Number and Type of Global Signals
2.1.5. Signal Activity x
2.1.5.1. Toggle Rate 2.1.5.2. Static Probability
2.3. Power-Driven Compilation x
2.3.1. Power-Driven Synthesis 2.3.2. Power-Driven Fitter 2.3.3. Area-Driven Synthesis 2.3.4. Gate-Level Register Retiming 2.3.5. Intel® Quartus® Prime Compiler Settings 2.3.6. Assignment Editor Options
2.3.1. Power-Driven Synthesis x
2.3.1.1. Memory Block Optimization 2.3.1.2. Power-Aware Logic Mapping 2.3.1.3. Power-Aware Memory Balancing
2.4. Design Guidelines x
2.4.1. Clock Power Management 2.4.2. Pipelining and Retiming 2.4.3. Architectural Optimization 2.4.4. I/O Power Guidelines 2.4.5. Dynamically Controlled On-Chip Terminations (OCT) Example: Power Saving for a DDR3 Interface with OCT 2.4.6. Memory Optimization (M20K/MLAB) 2.4.7. DDR Memory Controller Settings 2.4.8. DSP Implementation 2.4.9. Reducing High-Speed Tile (HST) Usage 2.4.10. Unused Transceiver Channels 2.4.11. Periphery Power reduction XCVR Settings
2.4.1. Clock Power Management x
2.4.1.1. Clock Gating 2.4.1.2. Clock Enable in Memory Blocks 2.4.1.3. LAB Clock Power 2.4.1.4. Clock Enables 2.4.1.5. Global Signals 2.4.1.6. Merge Clocks
2.4.1.1. Clock Gating x
2.4.1.1.1. Root Clock Gate 2.4.1.1.2. Sector Clock Gate 2.4.1.1.3. I/O PLL Clock Gate
2.4.1.3. LAB Clock Power x
2.4.1.3.1. LAB-Wide Clock Enable Example
2.4.1.5. Global Signals x
2.4.1.5.1. Viewing Clock Details in the Chip Planner
2.4.6. Memory Optimization (M20K/MLAB) x
2.4.6.1. Implementation 2.4.6.2. Rd/Wr Enables
2.4.11. Periphery Power reduction XCVR Settings x
2.4.11.1. Transceiver Settings 2.4.11.2. I/O Current Strength
2.5. Power Optimization Advisor x
2.5.1. Set Realistic Timing Constraints 2.5.2. Appropriate Device Family 2.5.3. Dynamic Power 2.5.4. Static Power 2.5.5. Appropriate I/O Standards 2.5.6. Use RAM Blocks 2.5.7. Shut Down RAM Blocks 2.5.8. Clock Enables on Logic 2.5.9. Pipeline Logic to Reduce Glitching
2.5.1. Set Realistic Timing Constraints x
2.5.1.1. Find Timing Information
1. Power Analysis
2. Power Optimization
3. Power Analysis and Optimization Document Archive
A. Intel® Quartus® Prime Pro Edition User Guides

2.4.5. Dynamically Controlled On-Chip Terminations (OCT)

Dynamic OCT enables series termination (RS) and parallel termination (RT) to dynamically turn on/off during the data transfer. This feature is especially useful in FPGAs with external memory interfaces, such as interfacing with DDR memories.

Dynamic OCT eliminates the constant DC power that parallel termination consumes when transmitting data, reducing power consumption when compared to conventional termination. Parallel termination is extremely useful for applications that interface with external memories where I/O standards, such as HSTL and SSTL, are used. Parallel termination supports dynamic OCT, which is useful for bidirectional interfaces.

For more information about dynamic OCT in specific devices, refer to the Intel® Stratix® 10 General Purpose I/O User Guide or the Intel® Arria® 10 Core Fabric and General Purpose I/O Handbook .

Example: Power Saving for a DDR3 Interface with OCT

The static current consumed by parallel OCT is equal to the VCCIO voltage divided by 100 W. For DDR3 interfaces with SSTL-15, the static current per pin is:

Therefore, the static power is:

For an interface with 72 DQ and 18 DQS pins, the static power is:

Dynamic parallel OCT disables parallel termination during write operations, so if writing occurs 50% of the time, the power saved by dynamic parallel OCT is:

For more information about dynamic OCT in Stratix® IV devices, refer to the chapter in the Stratix® IV Device Handbook.

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