Agilex™ 7 General-Purpose I/O User Guide: M-Series

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Date 7/08/2024
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Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 M-Series General-Purpose I/O Overview 2. Agilex™ 7 M-Series GPIO-B Banks 3. Agilex™ 7 M-Series HPS I/O Banks 4. Agilex™ 7 M-Series SDM I/O Banks 5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines 6. GPIO Intel® FPGA IP 7. Programmable I/O Features Description 8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series 9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives 10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series
1. Agilex™ 7 M-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 7 M-Series GPIO-B Banks x
2.1. GPIO-B Bank Overview 2.2. GPIO-B Features 2.3. GPIO-B Implementation Guide 2.4. GPIO-B Termination 2.5. GPIO-B Design Guidelines 2.6. GPIO-B Simulation
2.1. GPIO-B Bank Overview x
2.1.1. GPIO-B Bank Structure 2.1.2. GPIO-B Buffers and Registers
2.2. GPIO-B Features x
2.2.1. Supported I/O Standards for GPIO-B Banks 2.2.2. GPIO-B Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO-B Bank
2.2.3. Programmable I/O Element Features for the GPIO-B Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis 2.2.3.4. Guidelines: Programmable Receiver Equalization Calibration
2.3. GPIO-B Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. GPIO-B Programmable IOE Features Assignment Names and Settings
2.4. GPIO-B Termination x
2.4.1. Single-Ended I/O Termination in M-Series Devices 2.4.2. True Differential Signaling I/O Termination in M-Series Devices
2.4.1. Single-Ended I/O Termination in M-Series Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination in M-Series Devices x
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO-B Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks 2.5.14. GPIO-B Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO-B Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction 2.5.23. Implementing SLVS-400 Standard at 1.1 V VCCIO_PIO Sub-bank
2.6. GPIO-B Simulation x
2.6.1. IBIS Models—GPIO-B Support 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Agilex™ 7 M-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. Programmable I/O Element Features for the HPS I/O Bank 3.2.3. HPS I/O Buffer Behavior
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. HPS I/O Pins During Power Sequencing 3.4.2. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. IBIS Models—HPS I/O Support 3.5.2. Net Length Reports
4. Agilex™ 7 M-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. SDM I/O Pins During Power Sequencing 4.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
4.4. SDM I/O Simulation x
4.4.1. IBIS Models—SDM I/O Support 4.4.2. Net Length Reports
6. GPIO Intel® FPGA IP x
6.1. Release Information for GPIO Intel® FPGA IP 6.2. Generating the GPIO Intel® FPGA IP 6.3. GPIO Intel® FPGA IP Parameter Settings 6.4. GPIO Intel® FPGA IP Interface Signals 6.5. GPIO Intel® FPGA IP Architecture 6.6. Verifying Resource Utilization and Design Performance 6.7. GPIO Intel® FPGA IP Timing 6.8. GPIO Intel® FPGA IP Design Examples
6.2. Generating the GPIO Intel® FPGA IP x
6.2.1. Intel® FPGA IP Generation Output
6.3. GPIO Intel® FPGA IP Parameter Settings x
6.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.4. GPIO Intel® FPGA IP Interface Signals x
6.4.1. Shared Signals 6.4.2. Data Bit-Order for Data Interface 6.4.3. Input and Output Bus High and Low Bits 6.4.4. Data Interface Signals and Corresponding Clocks
6.5. GPIO Intel® FPGA IP Architecture x
6.5.1. GPIO Intel® FPGA IP Data Paths 6.5.2. Register Packing
6.5.1. GPIO Intel® FPGA IP Data Paths x
6.5.1.1. Input Path 6.5.1.2. Output and Output Enable Paths
6.7. GPIO Intel® FPGA IP Timing x
6.7.1. Timing Components 6.7.2. Delay Elements 6.7.3. Timing Analysis 6.7.4. Timing Closure Guidelines
6.7.3. Timing Analysis x
6.7.3.1. Single Data Rate Input Register 6.7.3.2. DDIO Input Register 6.7.3.3. Single Data Rate Output Register 6.7.3.4. DDIO Output Register
6.8. GPIO Intel® FPGA IP Design Examples x
6.8.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 6.8.2. GPIO Intel® FPGA IP Simulation Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage 7.4. Continuous Time Linear Equalization 7.5. Decision Feedback Equalization
1. Agilex™ 7 M-Series General-Purpose I/O Overview
2. Agilex™ 7 M-Series GPIO-B Banks
3. Agilex™ 7 M-Series HPS I/O Banks
4. Agilex™ 7 M-Series SDM I/O Banks
5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines
6. GPIO Intel® FPGA IP
7. Programmable I/O Features Description
8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series
9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series

2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank

If you use true differential I/O standards and single-ended I/O standards in the same or adjacent GPIO-B banks, adhere to the following placement guidelines. These restrictions do not apply to differential reference clock that feeds directly into the PLL reference clock ports.
  • Do not place true differential and toggling single-ended I/O standards in the combinations of locations listed in the following tables.
  • From version 24.1, the Quartus® Prime software issues the following errors:
    • Compilation error—violation of the same bank placement restriction.
    • Critical warning—assignment of true differential I/O standards to pin pairs with the following pin index numbers: 0 and 1, 6 and 7, 88 and 89, and 94 and 95.
Table 19.  Restricted Pin Placement Combinations for True Differential and Single-Ended I/O Standards in the Same GPIO-B Bank

This table lists the combinations of pins and I/O standards not allowed in the same GPIO-B bank. Examples:

  • If you place a true differential I/O standard in pin pair 10 and 11, do not place single-ended I/O standards in pins 9 or 18.
  • If you place a single-ended I/O standard in pin 57 or 66, do not place a true differential I/O standard in pin pair 58 and 59.
Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number)
True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin
0 and 1 2 24 and 25 17, 26 48 and 49 41, 50 72 and 73 65, 74
2 and 3 1, 4 26 and 27 25, 28 50 and 51 49, 52 74 and 75 73, 76
4 and 5 3, 12 28 and 29 27, 36 52 and 53 51, 60 76 and 77 75, 84
6 and 7 8 30 and 31 23, 32 54 and 55 47, 56 78 and 79 71, 80
8 and 9 7, 10 32 and 33 31, 34 56 and 57 55, 58 80 and 81 79. 82
10 and 11 9, 18 34 and 35 33, 42 58 and 59 57, 66 82 and 83 81, 90
12 and 13 5, 14 36 and 37 29, 38 60 and 61 53, 62 84 and 85 77, 86
14 and 15 13, 16 38 and 39 37, 40 62 and 63 61, 64 86 and 87 85, 88
16 and 17 15, 24 40 and 41 39, 48 64 and 65 63, 72 88 and 89 87
18 and 19 11, 20 42 and 43 35, 44 66 and 67 59, 68 90 and 91 83, 92
20 and 21 19, 22 44 and 45 43, 46 68 and 69 67, 70 92 and 93 91, 94
22 and 23 21, 30 46 and 47 45, 54 70 and 71 69, 78 94 and 95 93
Table 20.  Restricted Pin Placement Combinations for True Differential and Single-Ended I/O Standards in Adjacent GPIO-B Banks

This table lists the combinations of pins and I/O standards not allowed in adjacent GPIO-B banks. Examples:

  • If you place a true differential I/O standard in pin pair 6 and 7 of bank 3B, do not place single-ended I/O standards in pin 95 of bank 3A.
  • If you place a single-ended I/O standard in pin 0 of bank 2C, do not place a true differential I/O standard in pin pair 88 and 89 of bank 2D.
Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number)
True Differential Single-Ended True Differential Single-Ended
Bank Pin Pair Bank Pin Bank Pin Pair Bank Pin
3A 88 and 89 3B 0 2A 88 and 89 2B 89
94 and 95 6 94 and 95 95
3B 0 and 1 3A 89 2B 0 and 1 2C 89
6 and 7 95 6 and 7 95
88 and 89 3C 89 88 and 89 2A 89
94 and 95 95 94 and 95 95
3C 0 and 1 3D 89 2C 0 and 1 2D 89
6 and 7 95 6 and 7 95
88 and 89 3B 89 88 and 89 2B 0
94 and 95 95 94 and 95 6
3D 88 and 89 3C 0 2D 88 and 89 2C 0
94 and 95 6 94 and 95 6

Refer to the related information for the figure showing the locations of the GPIO-B banks.

Related Information
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