Agilex™ 7 General-Purpose I/O User Guide: M-Series

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ID 772138
Date 7/08/2024
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Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 M-Series General-Purpose I/O Overview 2. Agilex™ 7 M-Series GPIO-B Banks 3. Agilex™ 7 M-Series HPS I/O Banks 4. Agilex™ 7 M-Series SDM I/O Banks 5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines 6. GPIO Intel® FPGA IP 7. Programmable I/O Features Description 8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series 9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives 10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series
1. Agilex™ 7 M-Series General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 7 M-Series GPIO-B Banks x
2.1. GPIO-B Bank Overview 2.2. GPIO-B Features 2.3. GPIO-B Implementation Guide 2.4. GPIO-B Termination 2.5. GPIO-B Design Guidelines 2.6. GPIO-B Simulation
2.1. GPIO-B Bank Overview x
2.1.1. GPIO-B Bank Structure 2.1.2. GPIO-B Buffers and Registers
2.2. GPIO-B Features x
2.2.1. Supported I/O Standards for GPIO-B Banks 2.2.2. GPIO-B Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO-B Bank
2.2.3. Programmable I/O Element Features for the GPIO-B Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis 2.2.3.4. Guidelines: Programmable Receiver Equalization Calibration
2.3. GPIO-B Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. GPIO-B Programmable IOE Features Assignment Names and Settings
2.4. GPIO-B Termination x
2.4.1. Single-Ended I/O Termination in M-Series Devices 2.4.2. True Differential Signaling I/O Termination in M-Series Devices
2.4.1. Single-Ended I/O Termination in M-Series Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination in M-Series Devices x
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. GPIO-B Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks 2.5.14. GPIO-B Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO-B Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction 2.5.23. Implementing SLVS-400 Standard at 1.1 V VCCIO_PIO Sub-bank
2.6. GPIO-B Simulation x
2.6.1. IBIS Models—GPIO-B Support 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Agilex™ 7 M-Series HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. Programmable I/O Element Features for the HPS I/O Bank 3.2.3. HPS I/O Buffer Behavior
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. HPS I/O Design Guidelines x
3.4.1. HPS I/O Pins During Power Sequencing 3.4.2. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. IBIS Models—HPS I/O Support 3.5.2. Net Length Reports
4. Agilex™ 7 M-Series SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Configuration Pins
4.3. SDM I/O Design Guidelines x
4.3.1. SDM I/O Pins During Power Sequencing 4.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
4.4. SDM I/O Simulation x
4.4.1. IBIS Models—SDM I/O Support 4.4.2. Net Length Reports
6. GPIO Intel® FPGA IP x
6.1. Release Information for GPIO Intel® FPGA IP 6.2. Generating the GPIO Intel® FPGA IP 6.3. GPIO Intel® FPGA IP Parameter Settings 6.4. GPIO Intel® FPGA IP Interface Signals 6.5. GPIO Intel® FPGA IP Architecture 6.6. Verifying Resource Utilization and Design Performance 6.7. GPIO Intel® FPGA IP Timing 6.8. GPIO Intel® FPGA IP Design Examples
6.2. Generating the GPIO Intel® FPGA IP x
6.2.1. Intel® FPGA IP Generation Output
6.3. GPIO Intel® FPGA IP Parameter Settings x
6.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.4. GPIO Intel® FPGA IP Interface Signals x
6.4.1. Shared Signals 6.4.2. Data Bit-Order for Data Interface 6.4.3. Input and Output Bus High and Low Bits 6.4.4. Data Interface Signals and Corresponding Clocks
6.5. GPIO Intel® FPGA IP Architecture x
6.5.1. GPIO Intel® FPGA IP Data Paths 6.5.2. Register Packing
6.5.1. GPIO Intel® FPGA IP Data Paths x
6.5.1.1. Input Path 6.5.1.2. Output and Output Enable Paths
6.7. GPIO Intel® FPGA IP Timing x
6.7.1. Timing Components 6.7.2. Delay Elements 6.7.3. Timing Analysis 6.7.4. Timing Closure Guidelines
6.7.3. Timing Analysis x
6.7.3.1. Single Data Rate Input Register 6.7.3.2. DDIO Input Register 6.7.3.3. Single Data Rate Output Register 6.7.3.4. DDIO Output Register
6.8. GPIO Intel® FPGA IP Design Examples x
6.8.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 6.8.2. GPIO Intel® FPGA IP Simulation Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage 7.4. Continuous Time Linear Equalization 7.5. Decision Feedback Equalization
1. Agilex™ 7 M-Series General-Purpose I/O Overview
2. Agilex™ 7 M-Series GPIO-B Banks
3. Agilex™ 7 M-Series HPS I/O Banks
4. Agilex™ 7 M-Series SDM I/O Banks
5. Agilex™ 7 M-Series I/O Troubleshooting Guidelines
6. GPIO Intel® FPGA IP
7. Programmable I/O Features Description
8. Documentation Related to the Agilex™ 7 General-Purpose I/O User Guide: M-Series
9. Agilex™ 7 General-Purpose I/O User Guide: M-Series Archives
10. Document Revision History for the Agilex™ 7 General-Purpose I/O User Guide: M-Series

6.4. GPIO Intel® FPGA IP Interface Signals

Depending on the parameter settings you specify, different interface signals are available for the GPIO IP.
Figure 30.  GPIO IP Interfaces


Figure 31.  GPIO Interface Signals


Table 48.  Pad Interface SignalsThe pad interface is the physical connection from the GPIO IP to the pad. This interface can be an input, output or bidirectional interface, depending on the IP configuration. In this table, SIZE is the data width specified in the IP parameter editor.
Signal Name Direction Description
pad_in[SIZE-1:0] Input

Input signal from the pad.
pad_in_b[SIZE-1:0] Input

Negative node of the differential input signal from the pad. This port is available if you turn on the Use differential buffer option.

pad_out[SIZE-1:0] Output Output signal to the pad.
pad_out_b[SIZE-1:0] Output

Negative node of the differential output signal to the pad. This port is available if you turn on the Use differential buffer option.

pad_io[SIZE-1:0] Bidirectional

Bidirectional signal connection with the pad.
pad_io_b[SIZE-1:0] Bidirectional

Negative node of the differential bidirectional signal connection with the pad. This port is available if you turn on the Use differential buffer option.

Table 49.  Data Interface SignalsThe data interface is an input or output interface from the GPIO IP to the FPGA core. In this table, SIZE is the data width specified in the IP parameter editor.
Signal Name Direction Description
din[DATA_SIZE-1:0] Input

Data input from the FPGA core in output or bidirectional mode. DATA_SIZE depends on the register mode:

  • Bypass or simple register— DATA_SIZE = SIZE
  • DDIO— DATA_SIZE = 2 × SIZE
dout[DATA_SIZE-1:0] Output

Data output to the FPGA core in input or bidirectional mode, DATA_SIZE depends on the register mode:

  • Bypass or simple register— DATA_SIZE = SIZE
  • DDIO— DATA_SIZE = 2 × SIZE
oe[OE_SIZE-1:0] Input

OE input from the FPGA core in output mode with Enable output enable port turned on, or bidirectional mode. OE is active high. When transmitting data, set this signal to 1. When receiving data, set this signal to 0. OE_SIZE depends on the register mode:

  • Bypass or simple register— DATA_SIZE = SIZE
  • DDIO— DATA_SIZE = SIZE
Table 50.  Clock Interface SignalsThe clock interface is an input clock interface. It consists of different signals, depending on the configuration. The GPIO IP can have zero, one, two, or four clock inputs. Clock ports appear differently in different configurations to reflect the actual function performed by the clock signal.
Signal Name Direction Description
ck Input

In input and output paths, this clock feeds a packed register or DDIO.

In bidirectional mode, this clock is the unique clock for the input and output paths if you turn off the Separate input/output Clocks parameter.

ck_in Input

In bidirectional mode, these clocks feed a packed register or DDIO in the input and output paths if you turn on the Separate input/output Clocks parameter.

ck_out
cke Input Clock enable.
Table 51.  Reset Interface SignalsThe reset interface connects the GPIO IP core to the DDIOs.
Signal Name Direction Description
sclr Input

Synchronous clear input. Not available if you select None or Preset for the Enable synchronous clear / preset port option.

aclr Input

Asynchronous clear input. Active high. Not available if you select None or Preset for the Enable asynchronous clear / preset port option.

aset Input

Asynchronous set input. Active high. Not available if you select None or Clear for the Enable asynchronous clear / preset port option.

sset Input Synchronous set input. Not available if you select None or Clear for the Enable synchronous clear / preset port option.

Section Content
Shared Signals
Data Bit-Order for Data Interface
Input and Output Bus High and Low Bits
Data Interface Signals and Corresponding Clocks

Level Two Title