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1.4.5.1. R-Tiles Features and Capabilities
1.4.5.2. R-Tile Design Layout Examples
1.4.5.3. Landing Pad Cut-out Optimization of AC Coupling Capacitor
1.4.5.4. R-tile HSSI Breakout Routing in BGA Area and MCIO connector Pin Area
1.4.5.5. AC Coupling Capacitor Placement Around MCIO Connector
1.4.5.6. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
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1.1. Supported Protocols
For supported protocols, refer to the Agilex™ 7 FPGAs and SoCs Device Overview. For device characteristics, refer to the Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series. For transceiver details, refer to the relevant transceiver user guide. For protocol-specific layout requirements, refer to the relevant protocol specification.