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1.4.5.1. R-Tiles Features and Capabilities
1.4.5.2. R-Tile Design Layout Examples
1.4.5.3. Landing Pad Cut-out Optimization of AC Coupling Capacitor
1.4.5.4. R-tile HSSI Breakout Routing in BGA Field Area and MCIO connector Pin Area
1.4.5.5. AC Coupling Capacitor Placement Around MCIO Connector
1.4.5.6. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
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1.4.1.3. Connector Breakout
For high-speed routing, use the correct breakout orientation to avoid long stubs caused by the connector pin and PCB pad.
Figure 13. Connector Pin and PCB Pad ConnectionThis is a surface-mount, ground-signal-signal-ground connector pin interconnection with the PCB. The different layers in the stackup are indicated with different colors.
Optimize and tune the connector break-in and breakout to reach the target trace impedance and increase continuity. To accurately capture the interaction between the connector pin and PCB pad, co-simulate the connector-to-PCB interaction with connector structures integrated with the PCB by a 3D EM simulation tool.