Agilex™ 7 Device Family High-Speed Serial Interface Signal Integrity Design Guidelines

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ID 683864
Date 11/20/2024
Public
Document Table of Contents
Document Table of Contents x
1. Signal Integrity (SI) in High-Speed PCB Designs
1. Signal Integrity (SI) in High-Speed PCB Designs x
1.1. Supported Protocols 1.2. Channel Insertion Loss (IL) Budget Calculation 1.3. PCB Materials and Stackup Design Guidelines 1.4. PCB Design Guidelines 1.5. Document Revision History for the Agilex™ 7 Device Family High-Speed Serial Interface Signal Integrity Design Guidelines
1.3. PCB Materials and Stackup Design Guidelines x
1.3.1. Mitigating Insertion Loss with Dielectric Material 1.3.2. Power Layers 1.3.3. Reference Planes 1.3.4. Layer Assignment 1.3.5. Impedance 1.3.6. Via Drill Size 1.3.7. Fiber Weave 1.3.8. Reference Stackup
1.4. PCB Design Guidelines x
1.4.1. General PCB Design Guidelines 1.4.2. E-Tile PCB Design Guidelines 1.4.3. F-Tile PCB Design Guidelines 1.4.4. P-Tile PCB Design Guidelines 1.4.5. R-Tile PCB Guidelines
1.4.1. General PCB Design Guidelines x
1.4.1.1. PCB Traces 1.4.1.2. PCB Vias 1.4.1.3. Connector Breakout 1.4.1.4. AC Coupling Capacitor 1.4.1.5. Others
1.4.3. F-Tile PCB Design Guidelines x
1.4.3.1. F-Tile Features and Capabilities 1.4.3.2. Optimizing the Passive Channel 1.4.3.3. COM Simulations 1.4.3.4. Simulating the Active Channel
1.4.5. R-Tile PCB Guidelines x
1.4.5.1. R-Tiles Features and Capabilities 1.4.5.2. R-Tile Design Layout Examples 1.4.5.3. Landing Pad Cut-out Optimization of AC Coupling Capacitor 1.4.5.4. R-tile HSSI Breakout Routing in BGA Area and MCIO connector Pin Area 1.4.5.5. AC Coupling Capacitor Placement Around MCIO Connector 1.4.5.6. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
1. Signal Integrity (SI) in High-Speed PCB Designs

1.4.1.4. AC Coupling Capacitor

The layout design of AC coupling capacitors can impact high-speed channel performance.
  • Use a 0402 or 0201 size capacitor for a smaller parasitic and smaller footprint.
  • Place the AC coupling capacitors at the device end or connector end. Do not place them in the middle of the trace routing.
  • Keep the placement of the AC coupling capacitors on the two lines of a differential pair symmetrical, make sure that the fan-in and fan-out routing of the capacitors is symmetric, and make sure the line lengths on both end sides of the capacitors are matched.
  • Similar to the connector landing pad, optimize the cut-out size under the capacitor pad using a 3D EM simulation tool for your specific stackup and capacitor pad size. Cut the direct, next-layer ground plane of the capacitor pad. Make sure there is no other signal routing on adjacent layer underneath the cut-out to avoid potential cross talk.
Figure 14. AC Coupling Capacitor Layout
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