Agilex™ 7 Device Family High-Speed Serial Interface Signal Integrity Design Guidelines
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1.3.8. Reference Stackup
The following figure is a Type-III PCIe* add-in card reference stackup example. With 18 layers, the total board thickness is 62 mils. It has two 1 oz power layers at the center of the stackup referenced to the two ground layers on each side. The card uses the ground-signal-ground layer pattern for all signal configurations and a dense weave (1078, 1035) prepreg and core for dielectric prepreg and core.