Cyclone® V Device Overview

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ID 683694
Date 5/07/2018
Public
Document Table of Contents
Document Table of Contents x
Cyclone V Device Overview
Cyclone V Device Overview x
Key Advantages of Cyclone® V Devices Summary of Cyclone® V Features Cyclone® V Device Variants and Packages I/O Vertical Migration for Cyclone® V Devices Adaptive Logic Module Variable-Precision DSP Block Embedded Memory Blocks Clock Networks and PLL Clock Sources FPGA General Purpose I/O PCIe* Gen1 and Gen2 Hard IP External Memory Interface Low-Power Serial Transceivers SoC with HPS Dynamic Reconfiguration Enhanced Configuration and Configuration via Protocol Power Management Document Revision History for Cyclone® V Device Overview
Cyclone® V Device Variants and Packages x
Cyclone® V E Cyclone® V GX Cyclone® V GT Cyclone® V SE Cyclone® V SX Cyclone® V ST
Cyclone® V E x
Available Options Maximum Resources Package Plan
Cyclone® V GX x
Available Options Maximum Resources Package Plan
Cyclone® V GT x
Available Options Maximum Resources Package Plan
Cyclone® V SE x
Available Options Maximum Resources Package Plan
Cyclone® V SX x
Available Options Maximum Resources Package Plan
Cyclone® V ST x
Available Options Maximum Resources Package Plan
Embedded Memory Blocks x
Types of Embedded Memory Embedded Memory Capacity in Cyclone V Devices Embedded Memory Configurations
External Memory Interface x
Hard and Soft Memory Controllers External Memory Performance HPS External Memory Performance
Low-Power Serial Transceivers x
Transceiver Channels PMA Features PCS Features
SoC with HPS x
HPS Features FPGA Configuration and Processor Booting Hardware and Software Development
HPS Features x
System Peripherals and Debug Access Port HPS–FPGA AXI Bridges HPS SDRAM Controller Subsystem
Dynamic Reconfiguration x
Dynamic Reconfiguration Partial Reconfiguration
Cyclone V Device Overview

I/O Vertical Migration for Cyclone® V Devices

Figure 7. Vertical Migration Capability Across Cyclone® V Device Packages and DensitiesThe arrows indicate the vertical migration paths. The devices included in each vertical migration path are shaded. You can also migrate your design across device densities in the same package option if the devices have the same dedicated pins, configuration pins, and power pins.


You can achieve the vertical migration shaded in red if you use only up to 175 GPIOs for the M383 package, and 138 GPIOs for the U672 package. These migration paths are not shown in the Intel® Quartus® Prime software Pin Migration View.

Note: To verify the pin migration compatibility, use the Pin Migration View window in the Intel® Quartus® Prime software Pin Planner.
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