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2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices
2.2. I/O Element Structure in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices
3.1. Guideline: VREF Sources and VREF Pins
3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards
3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing
3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down
3.6. Guideline: Maximum DC Current Restrictions
3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks
3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400
3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
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4.1. GPIO Intel® FPGA IP
The GPIO IP core supports the GPIO components and features of the Intel® Stratix® 10 device family. You can use the Intel® Quartus® Prime parameter editor to configure the GPIO IP core.
Components of the GPIO IP core:
- Double data rate input/output (DDIO)—doubles or halves the data-rate of a communication channel
- Delay chains—configure the delay chains to perform specific delay and assist in I/O timing closure
- I/O buffers—connect the pads to the FPGA
Note: The 3 V I/O banks in Intel® Stratix® 10 devices do not support the DDIO feature of the GPIO IP core. Bypass the DDIO if you use an I/O standard supported only by 3 V I/O banks, such as 3.0 V LVCMOS. To bypass the DDIO feature, set the Register mode of the GPIO IP core to none.