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1. Overview
2. Getting Started
3. Powering Up the Development Kit
4. Board Test System
5. Development Kits Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Intel Agilex® 7 FPGA F-Series Development Kit User Guide
A. Development Kit Components
B. Additional Information
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A.4. Memory Interfaces
The Intel Agilex® 7 FPGA F-Series Development Kit has four channels of 288 pin DDR4 DIMM 72-bit interfaces: DDR4 DIMM CH0, DDR4 DIMM CH1,DDR4 DIMM CH2 and DDR4 DIMM CH3.
DDR4 DIMM CH1 is designed for HPS dedicated applications. The other three memory channels are for FPGA general usage and support both DDR4 and DDR-T ( Intel® Optane™ PMem modules).
- DDR4 DIMM CH0 is located in FPGA Bank 3A and 3B. It supports both DDR4 and DDR-T modules.
- DDR4 DIMM CH1 is located in FPGA Bank 3C and 3D. It only supports DDR4 module.
- DDR4 DIMM CH2 is located in FPGA Bank 2A and 2B. It supports both DDR4 and DDR-T modules.
- DDR4 DIMM CH3 is located in FPGA Bank 2C and 2D. It supports both DDR4 and DDR-T modules.