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1. Intel Agilex® 7 M-Series LVDS SERDES Overview
2. Intel Agilex® 7 M-Series LVDS SERDES Architecture
3. Intel Agilex® 7 M-Series LVDS SERDES Transmitter
4. Intel Agilex® 7 M-Series LVDS SERDES Receiver
5. Intel Agilex® 7 M-Series High-Speed LVDS I/O Implementation Guide
6. Intel Agilex® 7 M-Series LVDS SERDES Timing
7. LVDS SERDES Intel® FPGA IP Design Examples
8. Intel Agilex® 7 M-Series LVDS SERDES Design Guidelines
9. Intel Agilex® 7 M-Series LVDS SERDES Troubleshooting Guidelines
10. Documentation Related to the Intel Agilex® 7 LVDS SERDES User Guide: M-Series
11. Document Revision History for the Intel Agilex® 7 LVDS SERDES User Guide: M-Series
8.1. Use PLLs in Integer PLL Mode for LVDS
8.2. Use High-Speed Clock from PLL to Clock SERDES Only
8.3. Pin Placement for Differential Channels
8.4. SERDES Pin Pairs for Soft-CDR Mode
8.5. Placing LVDS Transmitters and Receivers in the Same GPIO-B Sub-Bank
8.6. VCCIO_PIO Power Scheme for LVDS SERDES
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2.1. Intel Agilex® 7 GPIO-B Banks, SERDES, and DPA Locations
The GPIO-B banks are located at the top and bottom I/O bank rows.
Figure 1. M-Series I/O Bank Structure (Die Top View)This figure shows the GPIO-B bank structure of the M-Series device. The figure shows the view of the die as shown in the Intel® Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of GPIO-B banks. Refer to the device pin-out files for available GPIO-B banks and the locations of the SDM shared and HPS shared GPIO-B banks for each device package.
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