2024.09.06 |
- Added support for ACE5-Lite cache stashing for the FPGA–to–HPS bridge.
- Updated the variable precision DSP support with up to 4.69 TFLOPS.
- Updated the B15A VPBGA package pin counts from 324 to 351.
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2024.08.16 |
- Replaced package B23A to B23D in the D-Series package options.
- Replaced package B32A to B32B in the D-Series package options.
- Updated the Variable Pitch BGA (VPBGA) information to clarify that the VPBGA ball pitch is variable, ranging from 0.65 mm to 1.45 mm in a single package to ease signal routing.
- Updated Figure: Comparison Between Standard BGA and VPBGA and Figure: Example of PCB Trace Routing for Variable Pitch BGA (VPBGA) Package.
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2024.04.01 |
- Added the adaptive logic module (ALM) counts.
- Removed package M16A from the A5E 028B device.
- Retitled the "Available Options" topic to "Part Number Decoder".
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2024.01.12 |
- Added 1.0 V LVCMOS support for the HSIO.
- Added notes that the minimum ball pitch of 0.65 mm is not meant for signal trace routing.
- Updated the fabric-feeding I/O PLL count for the following devices:
- A5D 051 and A5D 064—from 13 to 15
- A5E 043A and A5E 043B—from 11 to 13
- Added a figure that shows the available ordering part numbers.
- Removed support for ACE5-Lite cache stashing for the FPGA–to–HPS bridge.
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2023.09.18 |
- Updated references to "Balls Anywhere" to "Variable Pitch BGA (VPBGA)".
- Updated the package options and vertical migrations for E-Series FPGAs to remove information about conditional migration path.
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2023.05.15 |
- Updated the package options and vertical migrations:
- Added package B18A.
- Updated pin counts for packages B23B, B23A, and B32A.
- Added devices to package B23A of the E-Series FPGA Device Group A.
- Updated the supported DDR4 maximum width for E-Series FPGAs.
- Updated E-Series FPGA Device Group B to support up to PCIe 4.0.
- Assigned "GTS" naming to the transceivers.
- Updated information about the HPS L2 cache.
- Updated the E-Series HPS processors speeds:
- Dual core ARM® Cortex®-A76—from up to 1.6 GHz to up to:
- Device Group A—1.8 GHz
- Device Group B— 1.4 GHz
- Dual core ARM® Cortex®-A55—from up to 1.33 GHz to up to:
- Device Group A—1.5 GHz
- Device Group B— 1.25 GHz
- Updated the HPS block diagram.
- Removed ONFI 3.x and 4.x from HPS NAND flash controller.
- Updated HPS Ethernet MAC information:
- Updated the TSN endpoint functionality compliance.
- Removed MII, RMII, and GMII support.
- Updated RGMII support.
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2023.01.10 |
Initial release. |