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1.1. Failure Rates
1.2. Mitigating SEU Effects in Embedded User RAM
1.3. Mitigating SEU Effects in Configuration RAM
1.4. Internal Scrubbing
1.5. SEU Recovery
1.6. Intel® Quartus® Prime Software SEU FIT Reports
1.7. Triple-Module Redundancy
1.8. Evaluating a System's Response to Functional Upsets
1.9. CRAM Error Detection Settings Reference
1.10. Document Revision History
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1.6.2.2. Raw FIT
The Intel® Quartus® Prime Projected SEU FIT by Component Usage report provides raw FIT data.
Raw FIT is the FIT rate of the FPGA if the design uses every component. Raw FIT data is not design specific.
Note: The Intel Reliability Report, available on the Intel FPGA web site, also provides reliability data and testing procedures for Intel FPGA devices.
The Intel® Quartus® Prime software computes the FIT for each component using (component Mb × intrinsic FIT/Mb × Neutron Flux Multiplier) for the device family and process node. (For flip flops, “Mb” represents a million flip flops.)
To give the worst-case raw FIT, the report assumes the maximum amount of CRAM that implements MLABs in the device. Thus, the CRAM raw FIT is the sum of CRAM and MLAB entries.
Note: The Intel® Quartus® Prime software counts device bits for target devices using different parameter information than the Reliability Report. Therefore, the Intel® Quartus® Prime RAW SEU FIT rate is different from the EDCRC max FIT Rate based on the Reliability Report data. The EDCRC max FIT rate based on the Reliability Report data represents the likelihood of error in the CRAM indicated by CRC_ERROR pin.
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