AN 866: Mitigating and Debugging Single Event Upsets in Intel® Quartus® Prime Standard Edition

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ID 683869
Date 9/28/2021
Public
Document Table of Contents
Document Table of Contents x
1. Mitigating Single Event Upset 2. Debugging Single Event Upset Using the Fault Injection Debugger
1. Mitigating Single Event Upset x
1.1. Failure Rates 1.2. Mitigating SEU Effects in Embedded User RAM 1.3. Mitigating SEU Effects in Configuration RAM 1.4. Internal Scrubbing 1.5. SEU Recovery 1.6. Intel® Quartus® Prime Software SEU FIT Reports 1.7. Triple-Module Redundancy 1.8. Evaluating a System's Response to Functional Upsets 1.9. CRAM Error Detection Settings Reference 1.10. Document Revision History
1.2. Mitigating SEU Effects in Embedded User RAM x
1.2.1. Configuring RAM to Enable ECC
1.5. SEU Recovery x
1.5.1. Planning for SEU Recovery 1.5.2. Designating the Sensitivity of the Design Hierarchy 1.5.3. Advanced SEU Detection IP Core
1.5.2. Designating the Sensitivity of the Design Hierarchy x
1.5.2.1. Hierarchy Tagging 1.5.2.2. Using Partitions to Specify Logic Sensitivity ID
1.5.3. Advanced SEU Detection IP Core x
1.5.3.1. On-Chip Sensitivity Processor 1.5.3.2. External Sensitivity Processor
1.6. Intel® Quartus® Prime Software SEU FIT Reports x
1.6.1. SEU FIT Parameters Report 1.6.2. Projected SEU FIT by Component Usage Report 1.6.3. Enabling the Projected SEU FIT by Component Usage Report
1.6.2. Projected SEU FIT by Component Usage Report x
1.6.2.1. Component FIT Rates 1.6.2.2. Raw FIT 1.6.2.3. Utilized FIT 1.6.2.4. Mitigated FIT 1.6.2.5. Architectural Vulnerability Factor
1.6.2.3. Utilized FIT x
1.6.2.3.1. Comparing .smh Critical Bits Report to Utilized Bit Count 1.6.2.3.2. Considerations for Small Designs
2. Debugging Single Event Upset Using the Fault Injection Debugger x
2.1. Single Event Upset Mitigation 2.2. Hardware and Software Requirements 2.3. Using the Fault Injection Debugger and IP Core 2.4. Document Revision History
2.3. Using the Fault Injection Debugger and IP Core x
2.3.1. Instantiating the IP Core 2.3.2. Defining Fault Injection Areas 2.3.3. Using the Fault Injection Debugger 2.3.4. Command-Line Interface
2.3.1. Instantiating the IP Core x
2.3.1.1. About the EMR Unloader IP Core 2.3.1.2. About the Advanced SEU Detection IP Core
2.3.2. Defining Fault Injection Areas x
2.3.2.1. Performing Hierarchy Tagging 2.3.2.2. About SMH Files
2.3.3. Using the Fault Injection Debugger x
2.3.3.1. Configuring Your Device and the Fault Injection Debugger 2.3.3.2. Constraining Regions for Fault Injection 2.3.3.3. Specifying Error Types 2.3.3.4. Injecting Errors 2.3.3.5. Recording Errors 2.3.3.6. Clearing Injected Errors
2.3.4. Command-Line Interface x
2.3.4.1. Targeted Fault Injection Feature 2.3.4.2. Advanced Command-Line Options: ASD Regions and Error Type Weighting
2.3.4.1. Targeted Fault Injection Feature x
2.3.4.1.1. Specifying an Error List From the Command Line 2.3.4.1.2. Specifying an Error List From Prompt Mode 2.3.4.1.3. Determining CRAM Bit Locations
1. Mitigating Single Event Upset
2. Debugging Single Event Upset Using the Fault Injection Debugger

1.4. Internal Scrubbing

Intel® Arria® 10, select Cyclone® V (including SoC devices), and Stratix® V FPGAs support automatic CRAM error correction without reloading the original CRAM contents from an external copy of the original .sof.

The internal scrubbing feature corrects single-bit and double-adjacent errors automatically.

If the FPGA finds a CRC error in a CRAM frame, the FPGA reconstructs the frame from the error correcting code calculated for that frame. Then the FPGA writes the correct frame into the CRAM.

If you enable internal scrubbing, you must still plan a recovery sequence. Although scrubbing can restore the CRAM array to intended configuration, latency occurs between the soft error detection and correction. During this latency period, the FPGA may operate with errors. If the FPGA must scan a large number of configuration bits, this latency can be up to 100 milliseconds. For more information about latency refer to the device datasheet.

To enable internal scrubbing, click Assignments > Device > Device and Pin Options > Error Detection CRC and turn on the Enable internal scrubbing option.

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