AN 738: Intel® Arria® 10 Device Design Guidelines

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ID 683555
Date 6/30/2017
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Document Table of Contents
Document Table of Contents x
1. AN 738: Intel® Arria® 10 Device Design Guidelines
1. AN 738: Intel® Arria® 10 Device Design Guidelines x
1.1. System Specification 1.2. Device Selection 1.3. Early System and Board Planning 1.4. Pin Connection Considerations for Board Design 1.5. I/O and Clock Planning 1.6. Design Entry 1.7. Design Implementation, Analysis, Optimization, and Verification 1.8. Conclusion 1.9. Document Revision History 1.10. Design Checklist 1.11. Appendix: Arria® 10 Transceiver Design Guidelines
1.1. System Specification x
1.1.1. Design Specifications 1.1.2. IP Selection 1.1.3. Qsys
1.2. Device Selection x
1.2.1. Device Family Variant and High-Speed Transceivers 1.2.2. Logic, Memory, and Multiplier Density 1.2.3. I/O Pin Count, LVDS Channels, and Package Offering 1.2.4. PLLs and Clock Routing 1.2.5. Speed Grade 1.2.6. Vertical Device Migration
1.3. Early System and Board Planning x
1.3.1. Early Power Estimation 1.3.2. Temperature Sensing for Thermal Management 1.3.3. Voltage Sensor 1.3.4. Planning for Device Configuration 1.3.5. Planning for On-Chip Debugging
1.3.4. Planning for Device Configuration x
1.3.4.1. Configuration Scheme Selection 1.3.4.2. Configuration Features 1.3.4.3. Quartus Prime Configuration Settings
1.3.4.1. Configuration Scheme Selection x
1.3.4.1.1. Serial Configuration Devices 1.3.4.1.2. Download Cables 1.3.4.1.3. Using the Parallel Flash Loader Megafunction with MAX II Devices
1.3.4.2. Configuration Features x
1.3.4.2.1. Data Compression 1.3.4.2.2. Design Security Using Configuration Bitstream Encryption 1.3.4.2.3. Remote System Upgrades 1.3.4.2.4. SEU Mitigation and CRC Error Checks
1.3.5. Planning for On-Chip Debugging x
1.3.5.1. On-Chip Debugging Tools 1.3.5.2. Planning Guidelines for Debugging Tools
1.4. Pin Connection Considerations for Board Design x
1.4.1. Device Power-Up 1.4.2. Power Pin Connections and Power Supplies 1.4.3. Configuration Pin Connections 1.4.4. Board-Related Quartus Prime Settings 1.4.5. Signal Integrity Considerations 1.4.6. Board-Level Simulation and Advanced I/O Timing Analysis
1.4.2. Power Pin Connections and Power Supplies x
1.4.2.1. Decoupling Capacitors 1.4.2.2. PLL and Transceiver Board Design Guidelines
1.4.3. Configuration Pin Connections x
1.4.3.1. DCLK and TCK Signal Integrity 1.4.3.2. JTAG Pins 1.4.3.3. MSEL Configuration Mode Pins 1.4.3.4. Other Configuration Pins
1.4.4. Board-Related Quartus Prime Settings x
1.4.4.1. Device-Wide Output Enable Pin 1.4.4.2. Unused Pins
1.4.5. Signal Integrity Considerations x
1.4.5.1. High-Speed Board Design 1.4.5.2. Voltage Reference Pins 1.4.5.3. Simultaneous Switching Noise 1.4.5.4. I/O Termination
1.5. I/O and Clock Planning x
1.5.1. Making FPGA Pin Assignments 1.5.2. Early Pin Planning and I/O Assignment Analysis 1.5.3. I/O Features and Pin Connections 1.5.4. Clock and PLL Selection 1.5.5. PLL Feature Guidelines 1.5.6. Clock Control Block 1.5.7. I/O Simultaneous Switching Noise
1.5.3. I/O Features and Pin Connections x
1.5.3.1. I/O Signaling Type 1.5.3.2. Selectable I/O Standards and Flexible I/O Banks 1.5.3.3. Memory Interfaces 1.5.3.4. Dual-Purpose and Special Pin Connections 1.5.3.5. Arria® 10 I/O Features
1.5.5. PLL Feature Guidelines x
1.5.5.1. Clock Feedback Mode 1.5.5.2. Clock Outputs
1.6. Design Entry x
1.6.1. Design Recommendations 1.6.2. Using IP Cores 1.6.3. Reconfiguration 1.6.4. Recommended HDL Coding Styles 1.6.5. Register Power-Up Levels and Control Signals 1.6.6. Planning for Hierarchical and Team-Based Design
1.6.3. Reconfiguration x
1.6.3.1. Dynamic Reconfiguration 1.6.3.2. Partial Reconfiguration
1.6.6. Planning for Hierarchical and Team-Based Design x
1.6.6.1. Planning Design Partitions 1.6.6.2. Planning in Bottom-Up and Team-Based Flows 1.6.6.3. Creating a Design Floorplan
1.7. Design Implementation, Analysis, Optimization, and Verification x
1.7.1. Selecting a Synthesis Tool 1.7.2. Device Resource Utilization Reports 1.7.3. Quartus Prime Messages 1.7.4. Timing Constraints and Analysis 1.7.5. Area and Timing Optimization 1.7.6. Preserving Performance and Reducing Compilation Time 1.7.7. Simulation 1.7.8. Formal Verification 1.7.9. Power Analysis 1.7.10. Power Optimization
1.7.4. Timing Constraints and Analysis x
1.7.4.1. Recommended Timing Optimization and Analysis Assignments
1.7.10. Power Optimization x
1.7.10.1. Device and Design Power Optimization Techniques 1.7.10.2. Quartus Prime Power Optimization Techniques
1.7.10.1. Device and Design Power Optimization Techniques x
1.7.10.1.1. Clock Power Management 1.7.10.1.2. Memory Power Reduction 1.7.10.1.3. I/O Power Guidelines
1.7.10.2. Quartus Prime Power Optimization Techniques x
1.7.10.2.1. Power Optimization Advisor
1.11. Appendix: Arria® 10 Transceiver Design Guidelines x
1.11.1. Transceiver PHY Architecture Overview 1.11.2. Transceiver Bank Architecture 1.11.3. PHY Layer Transceiver Components 1.11.4. Transceiver Phase-Locked Loops 1.11.5. Clock Generation Block (CGB) 1.11.6. Calibration 1.11.7. Transceiver Design Flow
1.11.3. PHY Layer Transceiver Components x
1.11.3.1. The GX Transceiver Channel 1.11.3.2. The GT Transceiver Channel
1.11.4. Transceiver Phase-Locked Loops x
1.11.4.1. Advanced Transmit (ATX) PLL 1.11.4.2. Fractional PLL (fPLL) 1.11.4.3. Channel PLL (CMU/CDR PLL)
1. AN 738: Intel® Arria® 10 Device Design Guidelines

1. AN 738: Intel® Arria® 10 Device Design Guidelines

This document provides a set of design guidelines, recommendations, and a list of factors to consider for designs that use Intel® Arria® 10 devices. It is important to follow Intel® recommendations throughout the design process for high-density, high-performance Arria® 10 designs. This document also assists you with planning the FPGA and system early in the design process, which is crucial to successfully meet design requirements. For more information to help verify that you have followed each of the guidelines, use the “Design Checklist” topic in this app note.
Note: This application note does not include all Arria® 10 device details and features. For more information about Arria® 10 devices and features, refer to the " Intel® Arria® 10 Device Design Handbook".

The material references the Arria® 10 device architecture as well as aspects of the Quartus® Prime software and third-party tools that you might use in your design. The guidelines presented in this document can improve productivity and avoid common design pitfalls.

Table 1.  Summary of the Design Flow Stage and Guideline Topics
Stages of the Design Flow Guidelines
System Specification Planning design specifications, IP selection
Device Selection Device information, determining device variant and density, package offerings, migration, HardCopy ASICs, speed grade
Early System and Board Planning Early power estimation, thermal management option, planning for configuration scheme, planning for on-chip debugging
Pin Connection Considerations for Board Design Power-up, power pins, PLL connections, decoupling capacitors, configuration pins, signal integrity, board-level verification
I/O and Clock Planning Pin assignments, early pin planning, I/O features and connections, memory interfaces, clock and PLL selection, simultaneous switching noise (SSN)
Design Entry Coding styles and design recommendations, SOPC Builder, planning for hierarchical or team-based design
Design Implementation, Analysis, Optimization, and Verification Synthesis tool, device utilization, messages, timing constraints and analysis, area and timing optimization, compilation time, verification, power analysis and optimization
Figure 1.  Arria® 10 Device Design Flow
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