Intel® Stratix® 10 General Purpose I/O User Guide

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ID 683518
Date 7/07/2021
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Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 I/O Overview 2. Intel® Stratix® 10 I/O Architecture and Features 3. Intel® Stratix® 10 I/O Design Considerations 4. Intel® Stratix® 10 I/O Implementation Guides 5. GPIO Intel® FPGA IP Reference 6. Intel® Stratix® 10 General Purpose I/O User Guide Archives 7. Document Revision History for Intel® Stratix® 10 General Purpose I/O User Guide
1. Intel® Stratix® 10 I/O Overview x
1.1. Intel® Stratix® 10 I/O and Differential I/O Buffers 1.2. Intel® Stratix® 10 I/O Migration Support
2. Intel® Stratix® 10 I/O Architecture and Features x
2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices 2.2. I/O Element Structure in Intel® Stratix® 10 Devices 2.3. Programmable IOE Features in Intel® Stratix® 10 Devices 2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices 2.5. External I/O Termination for Intel® Stratix® 10 Devices
2.1. I/O Standards and Voltage Levels in Intel® Stratix® 10 Devices x
2.1.1. Intel® Stratix® 10 I/O Standards Support 2.1.2. Intel® Stratix® 10 I/O Standards Voltage Support
2.2. I/O Element Structure in Intel® Stratix® 10 Devices x
2.2.1. I/O Bank Architecture in Intel® Stratix® 10 Devices 2.2.2. I/O Buffer and Registers in Intel® Stratix® 10 Devices
2.3. Programmable IOE Features in Intel® Stratix® 10 Devices x
2.3.1. Programmable Output Slew Rate Control 2.3.2. Programmable IOE Delay 2.3.3. Programmable Open-Drain Output 2.3.4. Programmable Bus Hold 2.3.5. Programmable Pull-Up Resistor 2.3.6. Programmable Pre-Emphasis 2.3.7. Programmable Differential Output Voltage 2.3.8. Programmable Current Strength
2.4. On-Chip I/O Termination in Intel® Stratix® 10 Devices x
2.4.1. RS OCT without Calibration in Intel® Stratix® 10 Devices 2.4.2. RS OCT with Calibration in Intel® Stratix® 10 Devices 2.4.3. RT OCT with Calibration in Intel® Stratix® 10 Devices 2.4.4. Dynamic OCT 2.4.5. Differential Input RD OCT 2.4.6. OCT Calibration Block in Intel® Stratix® 10 Devices
2.5. External I/O Termination for Intel® Stratix® 10 Devices x
2.5.1. Single-Ended I/O Termination 2.5.2. Differential I/O Termination for Intel® Stratix® 10 Devices
2.5.2. Differential I/O Termination for Intel® Stratix® 10 Devices x
2.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 2.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 2.5.2.3. LVPECL Termination
3. Intel® Stratix® 10 I/O Design Considerations x
3.1. Guideline: VREF Sources and VREF Pins 3.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 3.3. Guideline: Voltage-Referenced and Non-Voltage Referenced I/O Standards 3.4. Guideline: Do Not Drive I/O Pins During Power Sequencing 3.5. Guideline: Intel® Stratix® 10 I/O Buffer During Power Up, Configuration, and Power Down 3.6. Guideline: Maximum DC Current Restrictions 3.7. Guideline: Use Only One Voltage for All 3 V I/O Banks 3.8. Guideline: I/O Standards Limitation for Intel® Stratix® 10 TX 400 3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400
4. Intel® Stratix® 10 I/O Implementation Guides x
4.1. GPIO Intel® FPGA IP 4.2. Verifying Resource Utilization and Design Performance 4.3. GPIO Intel® FPGA IP Timing 4.4. GPIO Intel® FPGA IP Design Examples 4.5. Verifying Pin Migration Compatibility 4.6. IP Migration to the GPIO IP Core
4.1. GPIO Intel® FPGA IP x
4.1.1. Release Information for GPIO Intel® FPGA IP 4.1.2. GPIO Intel® FPGA IP Data Paths 4.1.3. Register Packing
4.1.2. GPIO Intel® FPGA IP Data Paths x
4.1.2.1. Input Path 4.1.2.2. Output and Output Enable Paths
4.3. GPIO Intel® FPGA IP Timing x
4.3.1. Timing Components 4.3.2. Delay Elements 4.3.3. Timing Analysis 4.3.4. Timing Closure Guidelines
4.3.3. Timing Analysis x
4.3.3.1. Single Data Rate Input Register 4.3.3.2. Full-Rate or Half-Rate DDIO Input Register 4.3.3.3. Single Data Rate Output Register 4.3.3.4. Full-Rate or Half-Rate DDIO Output Register
4.4. GPIO Intel® FPGA IP Design Examples x
4.4.1. GPIO IP Core Synthesizable Intel® Quartus® Prime Design Example 4.4.2. GPIO IP Core Simulation Design Example
4.6. IP Migration to the GPIO IP Core x
4.6.1. Migrating Your ALTDDIO_IN, ALTDDIO_OUT, ALTDDIO_BIDIR, and ALTIOBUF IP Cores 4.6.2. Guideline: Swap datain_h and datain_l Ports in Migrated IP
5. GPIO Intel® FPGA IP Reference x
5.1. GPIO Intel® FPGA IP Parameter Settings 5.2. GPIO Intel® FPGA IP Interface Signals
5.2. GPIO Intel® FPGA IP Interface Signals x
5.2.1. Shared Signals 5.2.2. Data Bit-Order for Data Interface 5.2.3. Data Interface Signals and Corresponding Clocks
1. Intel® Stratix® 10 I/O Overview
2. Intel® Stratix® 10 I/O Architecture and Features
3. Intel® Stratix® 10 I/O Design Considerations
4. Intel® Stratix® 10 I/O Implementation Guides
5. GPIO Intel® FPGA IP Reference
6. Intel® Stratix® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® Stratix® 10 General Purpose I/O User Guide

3.9. Guideline: I/O Standards Limitation for Intel® Stratix® 10 GX 400 and SX 400

  • On the Intel® Stratix® 10 GX 400 or SX 400 device, do not use the following I/O standards in I/O banks 3A and 3D except in dedicated clock pins:
    • LVDS
    • Mini-LVDS
    • RSDS
  • Bank 3D has only 30 GPIO pins and supports only 1.8 V I/O standards.
  • Bank 3C supports only unidirectional single-ended I/O in 3.3 V or 3.0 V I/O standard.
  • In bank 3C, the control of I/O direction and features such as current strength is per eight-pin groups basis.
    • To identify the pin groups, refer to the Optional Function(s) column in device pin out files. For example, the group name is IO33_LS[<group index>]_[<pin index>].
    • As an example, if you configure any I/O pins from group LS1 as input, all the other pins in the group use the same setting. Similarly, if you use a pin in group LS0 as an output pin with 12 mA current strength, all pins in group LS0 apply the same setting.
    • You cannot configure input and output pins in the same group. You can only use all eight pins as input, or all eight pins as output.
  • If you use 3 V I/O standard in the design without assigning pin locations, the Intel® Quartus® Prime software automatically assigns the pins to bank 3C. If you want to assign the 3 V I/O standard to the 3 V I/O bank, specify the USE_AS_3V_GPIO Intel® Quartus® Prime assignment to the pin in the .qsf file.
Table 16.  Example of Eight-Pin Groups in Bank 3C
Pin Group Entry in Optional Function(s) Column Pin Name
LS1 IO33_LS1_0 Y2
IO33_LS1_1 AA2
IO33_LS1_2 AB1
IO33_LS1_3 AB2
IO33_LS1_4 AC1
IO33_LS1_5 AD1
IO33_LS1_6 AF2
IO33_LS1_7 AG2
LS0 IO33_LS0_0 U3
IO33_LS0_1 V3
IO33_LS0_2 U5
IO33_LS0_3 V4
IO33_LS0_4 W2
IO33_LS0_5 Y1
IO33_LS0_6 W3
IO33_LS0_7 W4
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