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Key Advantages of Intel® Cyclone® 10 GX Devices
Summary of Intel® Cyclone® 10 GX Features
Intel® Cyclone® 10 GX Available Options
Intel® Cyclone® 10 GX Maximum Resources
Intel® Cyclone® 10 GX Package Plan
I/O Vertical Migration for Intel® Cyclone® 10 GX Devices
Adaptive Logic Module
Variable-Precision DSP Block
Embedded Memory Blocks
Clock Networks and PLL Clock Sources
FPGA General Purpose I/O
External Memory Interface
PCIe Gen1 and Gen2 Hard IP
Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet
Low Power Serial Transceivers
Dynamic and Partial Reconfiguration
Enhanced Configuration and Configuration via Protocol
SEU Error Detection and Correction
Power Management
Incremental Compilation
Document Revision History for Intel® Cyclone® 10 GX Device Overview
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Transceiver Channels
All transceiver channels feature a dedicated Physical Medium Attachment (PMA) and a hardened Physical Coding Sublayer (PCS).
- The PMA provides primary interfacing capabilities to physical channels.
- The PCS typically handles encoding/decoding, word alignment, and other pre-processing functions before transferring data to the FPGA core fabric.
A transceiver channel consists of a PMA and a PCS block. Most transceiver banks have 6 channels. There are some transceiver banks that contain only 4 channels.
A wide variety of bonded and non-bonded data rate configurations is possible using a highly configurable clock distribution network.
Figure 5. Device Chip Overview for Intel® Cyclone® 10 GX DevicesThis figure is a graphical representation of a top view of the silicon die, which corresponds to a reverse view for flip chip packages. Different Intel® Cyclone® 10 GX devices may have different floorplans than the one shown in this figure.