Intel® FPGA Power and Thermal Calculator User Guide

Download PDF
ID 683445
Date 3/28/2022
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Overview of the Intel® FPGA Power and Thermal Calculator 2. Setting Up the Intel® FPGA Power and Thermal Calculator 3. Intel® FPGA Power and Thermal Calculator Graphical User Interface 4. Intel® FPGA Power and Thermal Calculator Pages 5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator 6. Intel® FPGA Power and Thermal Calculator User Guide Archive 7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide A. Measuring Static Power
1. Overview of the Intel® FPGA Power and Thermal Calculator x
1.1. Intel® FPGA PTC Power Model Status 1.2. Definitions of Power Terms Used in this Document
2. Setting Up the Intel® FPGA Power and Thermal Calculator x
2.1. Availability 2.2. Obtaining the Standalone Intel® FPGA Power and Thermal Calculator 2.3. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator 2.4. Power Analysis for Dual-Core 1SG10M Intel® Stratix® 10 Devices
2.3. Estimating Power Consumption with the Intel® FPGA Power and Thermal Calculator x
2.3.1. Estimating Power Consumption Before Starting the FPGA Design 2.3.2. Estimating Power Consumption While Creating the FPGA Design 2.3.3. Estimating Power Consumption After Completing the FPGA Design
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface x
3.1. Intel® FPGA PTC Select Family Dialog Box 3.2. Intel® FPGA PTC Basic GUI Components
3.2. Intel® FPGA PTC Basic GUI Components x
3.2.1. Intel® FPGA PTC Data Entry Pages 3.2.2. Intel® FPGA PTC Field Types 3.2.3. Intel® FPGA PTC Input Field Dependencies 3.2.4. Intel® FPGA PTC Data Entry Error Messages
4. Intel® FPGA Power and Thermal Calculator Pages x
4.1. Intel® FPGA PTC - Power Summary 4.2. Intel® FPGA PTC - Common Page Elements 4.3. Intel® FPGA PTC - Device Selection and Thermal Analysis Windows 4.4. Intel® FPGA PTC - Main Page 4.5. Intel® FPGA PTC - Logic Page 4.6. Intel® FPGA PTC - RAM Page 4.7. Intel® FPGA PTC - DSP Page 4.8. Intel® FPGA PTC - Clock Page 4.9. Intel® FPGA PTC - PLL Page 4.10. Intel® FPGA PTC - I/O Page 4.11. Intel® FPGA PTC - I/O-IP Page 4.12. Intel® FPGA PTC - Transceiver Page 4.13. Intel® FPGA PTC - HPS Page 4.14. Intel® FPGA PTC - Crypto Page ( Intel® Agilex™ Devices with Crypto Blocks Only) 4.15. Intel® FPGA PTC - HBM Page ( Intel® Stratix® 10 Devices Only) 4.16. Intel® FPGA PTC - Thermal Page 4.17. Intel® FPGA PTC - Report Page
4.12. Intel® FPGA PTC - Transceiver Page x
4.12.1. Estimating E-Tile Channel PLL Power with the Intel Power and Thermal Calculator
5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator x
5.1. Toggle Rate 5.2. I/O Bank Allocation
1. Overview of the Intel® FPGA Power and Thermal Calculator
2. Setting Up the Intel® FPGA Power and Thermal Calculator
3. Intel® FPGA Power and Thermal Calculator Graphical User Interface
4. Intel® FPGA Power and Thermal Calculator Pages
5. Factors Affecting the Accuracy of the Intel® FPGA Power and Thermal Calculator
6. Intel® FPGA Power and Thermal Calculator User Guide Archive
7. Document Revision History for the Intel® FPGA Power and Thermal Calculator User Guide
A. Measuring Static Power

A. Measuring Static Power

Follow these steps to measure static power in your design.
  1. Verify that the device is properly configured and in user mode. (CONF_DONE, NSTATUS, NCONFIG, and INIT_DONE values should be high.)
  2. Wait until a stable junction temperature (thermal equilibrium) is reached.
    • Use of a thermally controlled chamber is recommended.
    • You can measure the junction temperature of the FPGA using the on-chip temperature sensing diode (TSD). Refer to your device documentation for details on using the TSD. Alternatively, you can measure the junction temperature with the Intel® Agilex™ Temperature Sensor IP Core, but with reduced accuracy.
    • If a thermally controlled chamber is not available, use temperature feedback from the on-chip TSD or Intel® Agilex™ Temperature Sensor IP Core to control a heat sink fan to achieve a desired junction temperature.
    • You can also use a heat gun to achieve a desired temperature; however, this method offers less thermal control.
  3. Keep all inputs constant and do not toggle any I/Os or any clock signals (except for the clock to the Intel® Agilex™ Temperature Sensor IP Core, if you are using the Intel® Agilex™ Temperature Sensor IP Core to measure temperature.)
  4. Depending on the board design, you can measure static current in one of several ways:
    • Use a regulator with the ability to measure voltage drop across a shunt resistor, and query the power measurement through the power management bus (PMBus)/system management bus (SMBus) interface.
    • If a regulator with PMBus/SMBus support is not available, you can measure the voltage drop across the shunt resistor manually for each power supply and calculate the current from the voltage drop.
    • If you use an external power supply, query the current measurement from the power supply according to the manufacturer's specifications.
  5. If you want to isolate and understand the static power component of your design's total power consumption, take several current measurements across a range of temperatures and record the junction temperature of each measurement. Refer to the junction temperatures to correlate static power measurements with their corresponding total power measurements.
  6. The silicon static power measurements can be compared with the static power estimate from the Intel® Quartus® Prime Power Analyzer report or the static values shown on the Report tab in the Intel® FPGA Power and Thermal Calculator.
Level Two Title