Stratix® 10 Embedded Memory User Guide

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ID 683423
Date 10/21/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 Embedded Memory Overview 2. Stratix® 10 Embedded Memory Architecture and Features 3. Stratix® 10 Embedded Memory Design Considerations 4. Stratix® 10 Embedded Memory IP References 5. Intel Stratix 10 Embedded Memory Design Example 6. Stratix® 10 Embedded Memory User Guide Archives 7. Document Revision History for the Stratix® 10 Embedded Memory User Guide
1. Stratix® 10 Embedded Memory Overview x
1.1. Stratix® 10 Embedded Memory Features
2. Stratix® 10 Embedded Memory Architecture and Features x
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks 2.2. Address Clock Enable Support 2.3. Asynchronous Clear and Synchronous Clear 2.4. Memory Blocks Error Correction Code (ECC) Support 2.5. Force-to-Zero 2.6. Coherent Read Memory 2.7. Freeze Logic 2.8. True Dual Port Dual Clock Emulator 2.9. 'X' Propagation Support in Simulation 2.10. Stratix® 10 Supported Embedded Memory IPs 2.11. Stratix® 10 Embedded Memory Clocking Modes 2.12. Stratix® 10 Embedded Memory Configurations 2.13. Initial Value of Read and Write Address Registers
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks x
2.1.1. Byte Enable Controls 2.1.2. Data Byte Output 2.1.3. Byte Enable Behavior
2.4. Memory Blocks Error Correction Code (ECC) Support x
2.4.1. Parity Bit 2.4.2. ECC Parity Flip 2.4.3. ECC Read-During-Write Behavior 2.4.4. Error Correction Code Truth Table
2.6. Coherent Read Memory x
2.6.1. Forwarding Logic
2.8. True Dual Port Dual Clock Emulator x
2.8.1. Reducing the DCFIFO Depth
2.11. Stratix® 10 Embedded Memory Clocking Modes x
2.11.1. Single Clock Mode 2.11.2. Read/Write Clock Mode 2.11.3. Input/Output Clock Mode 2.11.4. Asynchronous/Synchronous Clears in Clocking Modes 2.11.5. Output Read Data in Simultaneous Read/Write 2.11.6. Independent Clock Enables in Clocking Modes
2.12. Stratix® 10 Embedded Memory Configurations x
2.12.1. Mixed-Width Port Configurations
3. Stratix® 10 Embedded Memory Design Considerations x
3.1. Consider the Memory Block Selection 3.2. Consider the Concurrent Read Behavior 3.3. Read-During-Write (RDW) 3.4. Consider Power-Up State and Memory Initialization 3.5. Reduce Power Consumption 3.6. Avoid Providing Non-Deterministic Input 3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously 3.8. Including the Reset Release Intel® FPGA IP in Your Design 3.9. Resource and Timing Optimization Feature in MLAB Blocks 3.10. Consider the Memory Depth Setting 3.11. Consider Registering the Memory Output
3.3. Read-During-Write (RDW) x
3.3.1. Customize Read-During-Write Behavior
3.3.1. Customize Read-During-Write Behavior x
3.3.1.1. Same-Port Read-During-Write Mode 3.3.1.2. Mixed-Port Read-During-Write Mode
4. Stratix® 10 Embedded Memory IP References x
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs 4.2. eSRAM Intel® FPGA IP 4.3. FIFO Intel® FPGA IP 4.4. FIFO2 Intel® FPGA IP 4.5. Shift Register (RAM-based) Intel® FPGA IP
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs x
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs 4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters 4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters 4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters 4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters 4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters 4.1.7. RAM and ROM Interface Signals 4.1.8. Changing Parameter Settings Manually
4.1.8. Changing Parameter Settings Manually x
4.1.8.1. RAM and ROM Parameter Settings
4.2. eSRAM Intel® FPGA IP x
4.2.1. Release Information for eSRAM Intel® FPGA IP 4.2.2. eSRAM System Features 4.2.3. eSRAM Intel® FPGA IP Parameters 4.2.4. eSRAM Intel® FPGA IP Interface Signals 4.2.5. eSRAM Intel® FPGA IP Simulation Walk-Through 4.2.6. eSRAM Timing Diagrams
4.2.2. eSRAM System Features x
4.2.2.1. eSRAM Specifications 4.2.2.2. eSRAM Usage Model
4.3. FIFO Intel® FPGA IP x
4.3.1. Release Information for FIFO Intel® FPGA IP 4.3.2. Configuration Methods 4.3.3. Specifications 4.3.4. FIFO Functional Timing Requirements 4.3.5. SCFIFO ALMOST_EMPTY Functional Timing 4.3.6. FIFO Output Status Flag and Latency 4.3.7. FIFO Metastability Protection and Related Options 4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect 4.3.9. SCFIFO and DCFIFO Show-Ahead Mode 4.3.10. Different Input and Output Width 4.3.11. DCFIFO Timing Constraint Setting 4.3.12. Coding Example for Manual Instantiation 4.3.13. Design Example 4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing 4.3.15. Guidelines for Embedded Memory ECC Feature 4.3.16. FIFO Intel® FPGA IP Parameters 4.3.17. Reset Scheme
4.3.3. Specifications x
4.3.3.1. Verilog HDL Prototype 4.3.3.2. VHDL Component Declaration 4.3.3.3. VHDL LIBRARY-USE Declaration 4.3.3.4. FIFO Signals 4.3.3.5. FIFO Parameter Settings
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect x
4.3.8.1. Recovery and Removal Timing Violation Warnings when Compiling a DCFIFO
4.3.11. DCFIFO Timing Constraint Setting x
4.3.11.1. Embedded Timing Constraint 4.3.11.2. User Configurable Timing Constraint
4.3.11.2. User Configurable Timing Constraint x
4.3.11.2.1. SDC Commands
4.4. FIFO2 Intel® FPGA IP x
4.4.1. Release Information for FIFO2 Intel® FPGA IP 4.4.2. Configuration Methods 4.4.3. Fmax Target Measuring Methodology 4.4.4. Performance Considerations 4.4.5. FIFO2 Intel® FPGA IP Features 4.4.6. FIFO2 Intel® FPGA IP Parameters 4.4.7. FIFO2 Intel® FPGA IP Interface Signals 4.4.8. Reset and Clock Schemes
4.4.5. FIFO2 Intel® FPGA IP Features x
4.4.5.1. FIFO2 Specifications
4.4.6. FIFO2 Intel® FPGA IP Parameters x
4.4.6.1. FIFO2 Parameter Settings
4.4.7. FIFO2 Intel® FPGA IP Interface Signals x
4.4.7.1. SCFIFO Signals 4.4.7.2. DCFIFO Signals
4.4.8. Reset and Clock Schemes x
4.4.8.1. Clock Domains 4.4.8.2. Reset
4.4.8.2. Reset x
4.4.8.2.1. FIFO2 Intel® FPGA IP Reset Guidelines
4.5. Shift Register (RAM-based) Intel® FPGA IP x
4.5.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP 4.5.2. Shift Register (RAM-based) Intel® FPGA IP Features 4.5.3. Shift Register (RAM-based) Intel® FPGA IP General Description 4.5.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings 4.5.5. Shift Register Ports and Parameters Setting
5. Intel Stratix 10 Embedded Memory Design Example x
5.1. FIFO and FIFO2 Design Example
5.1. FIFO and FIFO2 Design Example x
5.1.1. Generating the Design Example 5.1.2. Simulating the Design Example
5.1.2. Simulating the Design Example x
5.1.2.1. Simulation Results
1. Stratix® 10 Embedded Memory Overview
2. Stratix® 10 Embedded Memory Architecture and Features
3. Stratix® 10 Embedded Memory Design Considerations
4. Stratix® 10 Embedded Memory IP References
5. Intel Stratix 10 Embedded Memory Design Example
6. Stratix® 10 Embedded Memory User Guide Archives
7. Document Revision History for the Stratix® 10 Embedded Memory User Guide

4.2.4. eSRAM Intel® FPGA IP Interface Signals

The following table lists the input and output signals of the eSRAM Intel® FPGA IP interface.
Table 35.  eSRAM Intel® FPGA IP Input and Output Signals
Signal Direction Width Description
refclk Input 1 Provide a PLL reference clock. This clock must be stable and free-running at device power-up for a successful configuration.
esram2f_clk Output 1 Core clock provided by the eSRAM to the fabric. Use this clock to drive core logics that are interfacing with the eSRAM. Otherwise, proper cross-clock domain circuitry is expected.
c<channel_number>_data_0 Input 1-72
  • 72 for clear channel data, or
  • 64 when ECC is enabled, or
  • 72 when ECC Bypass is enabled, the MSB (most significant bit) of data (data[71:64]) represents the parity bits.
c<channel_number>_wraddress_0 Input Range from

17–11

 Write address of the memory. Dependent on how many banks are enabled in the channel.
Note: Writing to an invalid address does nothing, because the targeted bank is not powered.
c<channel_number>_wren_n_0 Input 1 Active low write enable input for the wraddress port.
c<channel_number>_rdaddress_0 Input Range from

17–11

 Read address of the memory. Dependent on how many banks are enabled in the channel.
Note: If you attempt to read from an invalid address, the data returned is random and of no value.
c<channel_number>_rden_n_0 Input 1 Active low read enable input for the rdaddress port.
c<channel_number>_q_0 Output 72 or 64
  • 72 for clear channel data, or
  • 64 when ECC is enabled, or
  • 72 when ECC Bypass is enabled, the MSB of output (q[71:64]) represents the parity bits.
ECC Enabled
c<channel_number>_error_detect_0 Output 1 Asserts when an ECC error occurred on the read data retrieved from the eSRAM.
c<channel_number>_error_correct_0 Output 1 Asserts when an ECC error is successfully corrected. The memory content is not updated with the corrected data.
Dynamic ECC Bypass Enabled
c<channel_number>_eccencbypass_0 Input 1 Dynamically bypass the ECC Encoder. When active, this port allows user to inject parity bits through 8-bits MSB from data port (c<channel_number>_data_0[71:64]). When inactive, parity bits will be generated using internal ECC Encoder. This port can only be used when c<channel_number>_ecc_byp_enable parameter is set to "TRUE".
c<channel_number>_eccdecbypass_0 Input 1 Dynamically bypass the ECC Decoder. 8-bits MSB from output port (c<channel_number>_q_0[73:64]) represents the parity bits. Parity bits are not checked and the c<channel_number>_error_detect_0 and c<channel_number>_error_correct_0 signals should not assert. This port can only be used when c<channel_number>_ecc_byp_enable parameter is set to "TRUE".
Additional Options
c<channel_number>_sd_n_0 Input 1 Active low signal that dynamically shuts down channels. This signal shuts down power to periphery (active low) and memory core of the banks within the channel, with no memory data retention.

In addition to the channels that are statically shut down when choosing the number of channels to use in an eSRAM system, you can also dynamically shut down channels at run time.

Note: Memory contents are not retained when a channel is shut down.
iopll_lock2core Output 1 eSRAM IOPLL lock status.
  • High—Locked
  • Low—Unlocked or lock loss.
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