Technology |
- 28-nm TSMC process technology
- 0.85-V or 0.9-V core voltage
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Low-power serial transceivers |
- 28.05-Gbps transceivers on Stratix V GT devices
- Electronic dispersion compensation (EDC) for XFP, SFP+, QSFP, CFP optical module support
- Adaptive linear and decision feedback equalization
- Transmitter pre-emphasis and de-emphasis
- Dynamic reconfiguration of individual channels
- On-chip instrumentation (EyeQ non-intrusive data eye monitoring)
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Backplane capability |
- 600-Megabits per second (Mbps) to 12.5-Gbps data rate capability
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General-purpose I/Os (GPIOs) |
- 1.6-Gbps LVDS
- 1,066-MHz external memory interface
- On-chip termination (OCT)
- 1.2-V to 3.3-V interfacing for all Stratix V devices
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Embedded HardCopy Block |
- PCIe Gen3, Gen2, and Gen1 complete protocol stack, x1/x2/x4/x8 end point and root port
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Embedded transceiver hard IP |
- Interlaken physical coding sublayer (PCS)
- Gigabit Ethernet (GbE) and XAUI PCS
- 10G Ethernet PCS
- Serial RapidIO® (SRIO) PCS
- Common Public Radio Interface (CPRI) PCS
- Gigabit Passive Optical Networking (GPON) PCS
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Power management |
- Programmable Power Technology
- Quartus II integrated PowerPlay Power Analysis
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High-performance core fabric |
- Enhanced ALM with four registers
- Improved routing architecture reduces congestion and improves compile times
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Embedded memory blocks |
- M20K: 20-Kbit with hard error correction code (ECC)
- MLAB: 640-bit
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Variable precision DSP blocks |
- Up to 600 MHz performance
- Natively support signal processing with precision ranging from 9x9 up to 54x54
- New native 27x27 multiply mode
- 64-bit accumulator and cascade for systolic finite impulse responses (FIRs)
- Embedded internal coefficient memory
- Pre-adder/subtractor improves efficiency
- Increased number of outputs allows more independent multipliers
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Fractional PLLs |
- Fractional mode with third-order delta-sigma modulation
- Integer mode
- Precision clock synthesis, clock delay compensation, and zero delay buffer (ZDB)
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Clock networks |
- 800-MHz fabric clocking
- Global, quadrant, and peripheral clock networks
- Unused clock networks can be powered down to reduce dynamic power
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Device configuration |
- Serial and parallel flash interface
- Enhanced advanced encryption standard (AES) design security features
- Tamper protection
- Partial and dynamic reconfiguration
- Configuration via Protocol (CvP)
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High-performance packaging |
- Multiple device densities with identical package footprints enables seamless migration between different FPGA densities
- FBGA packaging with on-package decoupling capacitors
- Lead and RoHS-compliant lead-free options
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HardCopy V migration |
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