Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview

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ID 683149
Date 8/18/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview
1. Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview x
1.1. Intel® Stratix® 10 MX Devices 1.2. Innovations in Intel® Stratix® 10 MX Devices 1.3. Intel® Stratix® 10 MX Features Summary 1.4. Intel® Stratix® 10 MX Block Diagram 1.5. Intel® Stratix® 10 MX Family Plan 1.6. Heterogeneous 3D Stacked HBM2 DRAM Memory 1.7. Intel® Hyperflex™ Core Architecture 1.8. Heterogeneous 3D SiP Transceiver Tiles 1.9. Intel® Stratix® 10 MX Transceivers 1.10. PCI Express Gen1/Gen2/Gen3 Hard IP 1.11. 100G Ethernet MAC, Reed-Solomon FEC Hard IP, and KP-FEC Hard IP 1.12. 10G Ethernet Hard IP 1.13. Interlaken PCS Hard IP 1.14. External Memory and General Purpose I/O 1.15. Adaptive Logic Module (ALM) 1.16. Core Clocking 1.17. Fractional Synthesis PLLs and I/O PLLs 1.18. Internal Embedded Memory 1.19. Variable Precision DSP Block 1.20. Power Management 1.21. Device Configuration and Secure Device Manager (SDM) 1.22. Device Security 1.23. Configuration via Protocol Using PCI Express* 1.24. Partial and Dynamic Reconfiguration 1.25. Fast Forward Compile 1.26. Single Event Upset (SEU) Error Detection and Correction 1.27. Document Revision History for the Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview
1.5. Intel® Stratix® 10 MX Family Plan x
1.5.1. Available Options
1.9. Intel® Stratix® 10 MX Transceivers x
1.9.1. PMA Features 1.9.2. PCS Features
1. Intel® Stratix® 10 MX (DRAM System-in-Package) Device Overview

1.7. Intel® Hyperflex™ Core Architecture

Intel® Stratix® 10 MX devices are based on a monolithic core fabric featuring the new Intel® Hyperflex™ core architecture. The Intel® Hyperflex™ core architecture delivers 2X the clock frequency performance and up to 70% lower power compared to previous generation high-end FPGAs. Along with this performance breakthrough, the Intel® Hyperflex™ core architecture delivers a number of advantages including:

  • Higher Throughput—Capitalizes on 2X core clock frequency performance to obtain throughput breakthroughs
  • Improved Power Efficiency—Uses reduced IP size, enabled by Intel® Hyperflex™ , to consolidate designs which previously spanned multiple devices into a single device, thereby reducing power by up to 70% versus previous generation devices
  • Greater Design Functionality—Uses faster clock frequency to reduce bus widths and reduce IP size, freeing up additional FPGA resources to add greater functionality
  • Increased Designer Productivity—Boosts performance with less routing congestion and fewer design iterations using Hyper-Aware design tools, obtaining greater timing margin for more rapid timing closure

In addition to the traditional user registers found in the Adaptive Logic Modules (ALM), the Intel® Hyperflex™ core architecture introduces additional bypassable registers everywhere throughout the fabric of the FPGA. These additional registers, called Hyper-Registers are available on every interconnect routing segment and at the inputs of all functional blocks.

Figure 8. Bypassable Hyper-Register

The Hyper-Registers enable the following key design techniques to achieve the 2X core performance increases:

  • Fine grain Hyper-Retiming to eliminate critical paths
  • Zero latency Hyper-Pipelining to eliminate routing delays
  • Flexible Hyper-Optimization for best-in-class performance

By implementing these techniques in your design, the Hyper-Aware design tools automatically make use of the Hyper-Registers to achieve maximum core clock frequency.

Figure 9.  Intel® Hyperflex™ Core Architecture
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