Intel® Quartus® Prime Pro Edition User Guide: Design Constraints

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ID 683143
Date 4/03/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Constraining Designs 3. Interface Planning 4. Managing Device I/O Pins 5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Constraining Designs x
2.1. Specifying Design Constraints Designs in the GUI 2.2. Constraining Designs with Tcl Scripts 2.3. A Fully Iterative Scripted Flow 2.4. Constraining Designs Revision History
2.1. Specifying Design Constraints Designs in the GUI x
2.1.1. Global Constraints and Assignments 2.1.2. Node, Entity, and Instance-Level Constraints 2.1.3. Probing Between Components of the Intel® Quartus® Prime GUI 2.1.4. Specifying Timing Constraints in the GUI
2.1.2. Node, Entity, and Instance-Level Constraints x
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor 2.1.2.2. Specify NoC Constraints in NoC Assignment Editor 2.1.2.3. Specify I/O Constraints in Pin Planner 2.1.2.4. Plan Interface Constraints in Interface Planner and Tile Interface Planner 2.1.2.5. Adjust Constraints with the Chip Planner 2.1.2.6. Constraining Designs with the Design Partition Planner
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor x
2.1.2.1.1. Specifying Multi-Dimensional Bus Constraints
2.1.2.2. Specify NoC Constraints in NoC Assignment Editor x
2.1.2.2.1. NoC Assignment Editor Interface Controls
2.2. Constraining Designs with Tcl Scripts x
2.2.1. Create a Project and Apply Constraints 2.2.2. Assigning a Pin 2.2.3. Generating Intel® Quartus® Prime Settings Files 2.2.4. Synopsys* Design Constraint (.sdc) Files 2.2.5. Tcl-only Script Flows
3. Interface Planning x
3.1. Using Interface Planner 3.2. Using Tile Interface Planner 3.3. Interface Planning Revision History
3.1. Using Interface Planner x
3.1.1. Interface Planner User Interface 3.1.2. Interface Planner General Tool Flow 3.1.3. Interface Planner NoC Tool Flow 3.1.4. Interface Planner Reports
3.1.1. Interface Planner User Interface x
3.1.1.1. Flow Controls 3.1.1.2. Home Tab Controls 3.1.1.3. Assignments Tab Controls 3.1.1.4. Plan Tab Controls 3.1.1.5. Reports Tab Controls
3.1.2. Interface Planner General Tool Flow x
3.1.2.1. Step 1: Setup and Synthesize the Project 3.1.2.2. Step 2: Initialize Interface Planner 3.1.2.3. Step 3: Update Plan with Project Assignments 3.1.2.4. Step 4: Plan Periphery Placement 3.1.2.5. Step 5: Report Placement Data 3.1.2.6. Step 6: Validate and Export Plan Constraints
3.1.2.4. Step 4: Plan Periphery Placement x
3.1.2.4.1. Plan Clock Networks 3.1.2.4.2. Saving & Loading Floorplans
3.1.3. Interface Planner NoC Tool Flow x
3.1.3.1. Placing NoC Design Elements Using Interface Planner
3.1.3.1. Placing NoC Design Elements Using Interface Planner x
3.1.3.1.1. Recommended Placement Order for NoC Elements in Interface Planner 3.1.3.1.2. High-Speed Interconnect NoC Locations in Interface Planner
3.1.4. Interface Planner Reports x
3.1.4.1. Report Summary 3.1.4.2. Report Pins 3.1.4.3. Report HSSI Channels 3.1.4.4. Report Clocks 3.1.4.5. Report Periphery Locations 3.1.4.6. Report Cell Connectivity 3.1.4.7. Report Instance Assignments 3.1.4.8. Report NoC Performance
3.2. Using Tile Interface Planner x
3.2.1. Tile Interface Planner Terminology 3.2.2. Tile Interface Planner Tool Flow 3.2.3. Constraining Dynamic Reconfiguration IP 3.2.4. Tile Interface Planner GUI Reference
3.2.2. Tile Interface Planner Tool Flow x
3.2.2.1. Step 1: Instantiate IP and Run Design Analysis 3.2.2.2. Step 2: Initialize Tile Interface Planner 3.2.2.3. Step 3: Update Plan with Project Assignments 3.2.2.4. Step 4: Create a Tile Plan 3.2.2.5. Step 5: Save Tile Plan Assignments 3.2.2.6. Step 6: Run Logic Generation and Design Synthesis
3.2.2.4. Step 4: Create a Tile Plan x
3.2.2.4.1. Placing IP Components 3.2.2.4.2. Constraining IP Building Blocks
3.2.3. Constraining Dynamic Reconfiguration IP x
3.2.3.1. Defining a Dynamic Reconfiguration Group 3.2.3.2. Assigning Dynamic Reconfiguration Group Placement
3.2.4. Tile Interface Planner GUI Reference x
3.2.4.1. Flow Controls 3.2.4.2. Home Tab 3.2.4.3. Assignments Tab Controls 3.2.4.4. Plan Tab Controls 3.2.4.5. Tcl Console Window
3.2.4.4. Plan Tab Controls x
3.2.4.4.1. Design Tree and Filters 3.2.4.4.2. Reconfiguration Groups View 3.2.4.4.3. Legal Locations Pane
4. Managing Device I/O Pins x
4.1. I/O Planning Overview 4.2. Assigning I/O Pins 4.3. Importing and Exporting I/O Pin Assignments 4.4. Validating Pin Assignments 4.5. Verifying I/O Timing 4.6. Viewing Routing and Timing Delays 4.7. Scripting API 4.8. Managing Device I/O Pins Revision History
4.1. I/O Planning Overview x
4.1.1. Basic I/O Planning Flow 4.1.2. Integrating PCB Design Tools 4.1.3. Intel Device Terms
4.2. Assigning I/O Pins x
4.2.1. Assigning to Exclusive Pin Groups 4.2.2. Assigning Slew Rate and Drive Strength 4.2.3. Assigning Differential Pins 4.2.4. Entering Pin Assignments with Tcl Commands 4.2.5. Entering Pin Assignments in HDL Code
4.2.3. Assigning Differential Pins x
4.2.3.1. Overriding I/O Placement Rules on Differential Pins
4.2.5. Entering Pin Assignments in HDL Code x
4.2.5.1. Using Low-Level I/O Primitives
4.3. Importing and Exporting I/O Pin Assignments x
4.3.1. Importing and Exporting for PCB Tools 4.3.2. Migrating Assignments to Another Target Device
4.4. Validating Pin Assignments x
4.4.1. I/O Assignment Validation Rules 4.4.2. I/O Assignment Analysis 4.4.3. Understanding I/O Analysis Reports
4.4.2. I/O Assignment Analysis x
4.4.2.1. Early I/O Assignment Analysis Without Design Files 4.4.2.2. I/O Assignment Analysis With Design Files 4.4.2.3. Overriding Default I/O Pin Analysis
4.5. Verifying I/O Timing x
4.5.1. Running Advanced I/O Timing 4.5.2. Adjusting I/O Timing and Power with Capacitive Loading
4.5.1. Running Advanced I/O Timing x
4.5.1.1. Board Trace Models 4.5.1.2. Defining the Board Trace Model 4.5.1.3. Modifying the Board Trace Model 4.5.1.4. Specifying Near-End vs Far-End I/O Timing Analysis 4.5.1.5. Advanced I/O Timing Analysis Reports
4.7. Scripting API x
4.7.1. Generate Mapped Netlist 4.7.2. Reserve Pins 4.7.3. Set Location 4.7.4. Exclusive I/O Group 4.7.5. Slew Rate and Current Strength
1. Answers to Top FAQs
2. Constraining Designs
3. Interface Planning
4. Managing Device I/O Pins
5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

3.1.4.8. Report NoC Performance

For designs that include the Hard Memory NoC, you can interactively generate a NoC Performance Report in Interface Planner.

The NoC Performance Report generation performs a static analysis of the NoC initiator and target locations to evaluate whether the placement allows your design to meet the bandwidth requirements and transaction sizes that you specify in the NoC Assignment Editor. You can review the report, and then make changes in the Plan tab based on the results.

To access the NoC Performance Report in Interface Planner, click the Reports tab, and then double-click Report NoC Performance in the Tasks pane.

Figure 29. Sample NoC Performance Report


The NoC Performance Report reports performance data for each initiator to target connection. The latencies in this report are based on the minimum structural latency with respect to the initiator and target placement. These latencies are for the NoC portion of the path only. These latencies do not include any latency of, for instance, external memory access. Nor do these latencies account for potential delay due to congestion on the NoC. You can achieve lower minimum structural latency by placing the NoC initiators and targets closer together.

Table 20.  NoC Performance Report Data
NoC Performance Report Column Description
Requested RD BW The requested read bandwidth.
Requested WR BW The requested write bandwidth.
NoC Req latency The requested request latency.
NoC Res latency The requested response latency.
Initiator placement The placement location of the initiator element.
Target placement The placement location of the target element.
Message Text message that identifies the reason that the current placement cannot meet the requested bandwidth.

One possible reason the Message reports that the current placement cannot meet the requested bandwidth is because of over-saturation of an initiator or a target. For example, if the sum of all bandwidth requirements through a particular initiator is greater than the bandwidth that the initiator can support, based on the data width and operating frequency of its AXI4 interface. To avoid this problem, either reduce bandwidth requirements or increase bandwidth capability.

Another possible reason that the current placement cannot meet the requested bandwidth is over-saturation of the horizontal bandwidth available in the NoC. This condition is the result of multiple initiator to target connections requesting bandwidth in the same direction through a horizontal section of the NoC. The NoC Performance Report message reports the congested segments. You can adjust initiator placement to alleviate congestion.

Note: For important considerations when choosing initiator interface placement, refer to the tables in Horizontal Bandwidth Considerations, along with tables in High-Speed Interconnect NoC Locations in Interface Planner in the Intel Agilex 7 M-Series FPGA Network-on-Chip (NoC) User Guide to translate location choices into physical placements.

You can also view NoC elements in the Intel® Quartus® Prime Chip Planner, and view connectivity of NoC elements in following fitting in the NoC Connectivity Report, as the Intel Agilex 7 M-Series FPGA Network-on-Chip (NoC) User Guide.

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