Intel® Quartus® Prime Pro Edition User Guide: Design Constraints

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Date 4/03/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Constraining Designs 3. Interface Planning 4. Managing Device I/O Pins 5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Constraining Designs x
2.1. Specifying Design Constraints Designs in the GUI 2.2. Constraining Designs with Tcl Scripts 2.3. A Fully Iterative Scripted Flow 2.4. Constraining Designs Revision History
2.1. Specifying Design Constraints Designs in the GUI x
2.1.1. Global Constraints and Assignments 2.1.2. Node, Entity, and Instance-Level Constraints 2.1.3. Probing Between Components of the Intel® Quartus® Prime GUI 2.1.4. Specifying Timing Constraints in the GUI
2.1.2. Node, Entity, and Instance-Level Constraints x
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor 2.1.2.2. Specify NoC Constraints in NoC Assignment Editor 2.1.2.3. Specify I/O Constraints in Pin Planner 2.1.2.4. Plan Interface Constraints in Interface Planner and Tile Interface Planner 2.1.2.5. Adjust Constraints with the Chip Planner 2.1.2.6. Constraining Designs with the Design Partition Planner
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor x
2.1.2.1.1. Specifying Multi-Dimensional Bus Constraints
2.1.2.2. Specify NoC Constraints in NoC Assignment Editor x
2.1.2.2.1. NoC Assignment Editor Interface Controls
2.2. Constraining Designs with Tcl Scripts x
2.2.1. Create a Project and Apply Constraints 2.2.2. Assigning a Pin 2.2.3. Generating Intel® Quartus® Prime Settings Files 2.2.4. Synopsys* Design Constraint (.sdc) Files 2.2.5. Tcl-only Script Flows
3. Interface Planning x
3.1. Using Interface Planner 3.2. Using Tile Interface Planner 3.3. Interface Planning Revision History
3.1. Using Interface Planner x
3.1.1. Interface Planner User Interface 3.1.2. Interface Planner General Tool Flow 3.1.3. Interface Planner NoC Tool Flow 3.1.4. Interface Planner Reports
3.1.1. Interface Planner User Interface x
3.1.1.1. Flow Controls 3.1.1.2. Home Tab Controls 3.1.1.3. Assignments Tab Controls 3.1.1.4. Plan Tab Controls 3.1.1.5. Reports Tab Controls
3.1.2. Interface Planner General Tool Flow x
3.1.2.1. Step 1: Setup and Synthesize the Project 3.1.2.2. Step 2: Initialize Interface Planner 3.1.2.3. Step 3: Update Plan with Project Assignments 3.1.2.4. Step 4: Plan Periphery Placement 3.1.2.5. Step 5: Report Placement Data 3.1.2.6. Step 6: Validate and Export Plan Constraints
3.1.2.4. Step 4: Plan Periphery Placement x
3.1.2.4.1. Plan Clock Networks 3.1.2.4.2. Saving & Loading Floorplans
3.1.3. Interface Planner NoC Tool Flow x
3.1.3.1. Placing NoC Design Elements Using Interface Planner
3.1.3.1. Placing NoC Design Elements Using Interface Planner x
3.1.3.1.1. Recommended Placement Order for NoC Elements in Interface Planner 3.1.3.1.2. High-Speed Interconnect NoC Locations in Interface Planner
3.1.4. Interface Planner Reports x
3.1.4.1. Report Summary 3.1.4.2. Report Pins 3.1.4.3. Report HSSI Channels 3.1.4.4. Report Clocks 3.1.4.5. Report Periphery Locations 3.1.4.6. Report Cell Connectivity 3.1.4.7. Report Instance Assignments 3.1.4.8. Report NoC Performance
3.2. Using Tile Interface Planner x
3.2.1. Tile Interface Planner Terminology 3.2.2. Tile Interface Planner Tool Flow 3.2.3. Constraining Dynamic Reconfiguration IP 3.2.4. Tile Interface Planner GUI Reference
3.2.2. Tile Interface Planner Tool Flow x
3.2.2.1. Step 1: Instantiate IP and Run Design Analysis 3.2.2.2. Step 2: Initialize Tile Interface Planner 3.2.2.3. Step 3: Update Plan with Project Assignments 3.2.2.4. Step 4: Create a Tile Plan 3.2.2.5. Step 5: Save Tile Plan Assignments 3.2.2.6. Step 6: Run Logic Generation and Design Synthesis
3.2.2.4. Step 4: Create a Tile Plan x
3.2.2.4.1. Placing IP Components 3.2.2.4.2. Constraining IP Building Blocks
3.2.3. Constraining Dynamic Reconfiguration IP x
3.2.3.1. Defining a Dynamic Reconfiguration Group 3.2.3.2. Assigning Dynamic Reconfiguration Group Placement
3.2.4. Tile Interface Planner GUI Reference x
3.2.4.1. Flow Controls 3.2.4.2. Home Tab 3.2.4.3. Assignments Tab Controls 3.2.4.4. Plan Tab Controls 3.2.4.5. Tcl Console Window
3.2.4.4. Plan Tab Controls x
3.2.4.4.1. Design Tree and Filters 3.2.4.4.2. Reconfiguration Groups View 3.2.4.4.3. Legal Locations Pane
4. Managing Device I/O Pins x
4.1. I/O Planning Overview 4.2. Assigning I/O Pins 4.3. Importing and Exporting I/O Pin Assignments 4.4. Validating Pin Assignments 4.5. Verifying I/O Timing 4.6. Viewing Routing and Timing Delays 4.7. Scripting API 4.8. Managing Device I/O Pins Revision History
4.1. I/O Planning Overview x
4.1.1. Basic I/O Planning Flow 4.1.2. Integrating PCB Design Tools 4.1.3. Intel Device Terms
4.2. Assigning I/O Pins x
4.2.1. Assigning to Exclusive Pin Groups 4.2.2. Assigning Slew Rate and Drive Strength 4.2.3. Assigning Differential Pins 4.2.4. Entering Pin Assignments with Tcl Commands 4.2.5. Entering Pin Assignments in HDL Code
4.2.3. Assigning Differential Pins x
4.2.3.1. Overriding I/O Placement Rules on Differential Pins
4.2.5. Entering Pin Assignments in HDL Code x
4.2.5.1. Using Low-Level I/O Primitives
4.3. Importing and Exporting I/O Pin Assignments x
4.3.1. Importing and Exporting for PCB Tools 4.3.2. Migrating Assignments to Another Target Device
4.4. Validating Pin Assignments x
4.4.1. I/O Assignment Validation Rules 4.4.2. I/O Assignment Analysis 4.4.3. Understanding I/O Analysis Reports
4.4.2. I/O Assignment Analysis x
4.4.2.1. Early I/O Assignment Analysis Without Design Files 4.4.2.2. I/O Assignment Analysis With Design Files 4.4.2.3. Overriding Default I/O Pin Analysis
4.5. Verifying I/O Timing x
4.5.1. Running Advanced I/O Timing 4.5.2. Adjusting I/O Timing and Power with Capacitive Loading
4.5.1. Running Advanced I/O Timing x
4.5.1.1. Board Trace Models 4.5.1.2. Defining the Board Trace Model 4.5.1.3. Modifying the Board Trace Model 4.5.1.4. Specifying Near-End vs Far-End I/O Timing Analysis 4.5.1.5. Advanced I/O Timing Analysis Reports
4.7. Scripting API x
4.7.1. Generate Mapped Netlist 4.7.2. Reserve Pins 4.7.3. Set Location 4.7.4. Exclusive I/O Group 4.7.5. Slew Rate and Current Strength
1. Answers to Top FAQs
2. Constraining Designs
3. Interface Planning
4. Managing Device I/O Pins
5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

3.1.3. Interface Planner NoC Tool Flow

For designs targeting Intel Agilex® 7 M-Series FPGAs only, you can use Interface Planner to assign physical locations for Network-on-Chip (NoC) initiators, PLLs, and SSMs. The Hard Memory NoC facilitates high-bandwidth data movement between the FPGA core logic and memory resources, such as HBM2e and DDR5 memories. Refer to the Intel Agilex 7 M-Series FPGA Network-on-Chip (NoC) User Guide for details on the complete NoC flow including Interface Planner.

You can use Interface Planner to assign physical locations for NoC initiators, targets (as part of the HBM2e or external memory interfaces), PLLs, and SSMs. If you do not make physical assignments for NoC elements, the Fitter places NoC elements automatically during compilation.

You use the floorplan view in Interface Planner to place hard memory NoC and periphery elements. There are three floorplan views available:

  • NoC View—shows a filtered view of NoC initiators and targets.
  • Chip View—shows the placeable locations for hard memory NoC elements, including NoC initiators, targets, PLLs, and SSMs.
  • Package View—NoC elements are not visible in the Package View.

In the Chip View, the available NoC initiator and target locations appear as rows of small boxes across the top and bottom edges of the device, between the FPGA fabric and the periphery I/O structures. Placing your cursor over locations displays a tooltip indicating whether the location supports only an initiator, only a target, or both an initiator and a target.

The available NoC PLL and NoC SSM locations appear as smaller boxes at the end of the row of initiators and targets. The PLL and SSM locations appear at the left end of the rows (if using the Chip Top view), or at the right end of the rows (if using the Chip Bottom view).

Interface Planner Chip View, Closeup of NoC Features shows an example of the Interface Planner Chip View showing the top left corner of the die as viewed from the top. The two smaller pink boxes at the top left corner of the fabric are the locations of the NoC PLL and the NoC SSM.

Figure 18. Interface Planner Chip View, Closeup of NoC Features

In the NoC View, only the NoC initiators and targets are visible as larger rectangles. The targets and initiators for both high-speed NoC along the top edge of the die, and the high-speed NoC along the bottom edge of the die, are visible. Initiators and targets that may share the same location in the Chip View are split into separate elements in the NoC View.

The outer-top and outer-bottom rows are the targets for the top-edge NoC and bottom-edge NoC, respectively. Similarly, the inner-top and inner-bottom rows are the initiators for the top-edge NoC and bottom-edge NoC, respectively. As with the Chip View, if you place your cursor over one of these locations, a tooltip reports if that location supports a target or an initiator.

NoC View Showing Targets and Initiators is an example of the Interface Planner NoC View, showing the targets and initiators for both the top-edge NoC and the bottom-edge NoC.

Figure 19.  NoC View Showing Targets and Initiators



Section Content
Placing NoC Design Elements Using Interface Planner

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