Intel® Quartus® Prime Pro Edition User Guide: Design Constraints

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ID 683143
Date 4/03/2023
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Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. Constraining Designs 3. Interface Planning 4. Managing Device I/O Pins 5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
2. Constraining Designs x
2.1. Specifying Design Constraints Designs in the GUI 2.2. Constraining Designs with Tcl Scripts 2.3. A Fully Iterative Scripted Flow 2.4. Constraining Designs Revision History
2.1. Specifying Design Constraints Designs in the GUI x
2.1.1. Global Constraints and Assignments 2.1.2. Node, Entity, and Instance-Level Constraints 2.1.3. Probing Between Components of the Intel® Quartus® Prime GUI 2.1.4. Specifying Timing Constraints in the GUI
2.1.2. Node, Entity, and Instance-Level Constraints x
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor 2.1.2.2. Specify NoC Constraints in NoC Assignment Editor 2.1.2.3. Specify I/O Constraints in Pin Planner 2.1.2.4. Plan Interface Constraints in Interface Planner and Tile Interface Planner 2.1.2.5. Adjust Constraints with the Chip Planner 2.1.2.6. Constraining Designs with the Design Partition Planner
2.1.2.1. Specify Instance-Specific Constraints in Assignment Editor x
2.1.2.1.1. Specifying Multi-Dimensional Bus Constraints
2.1.2.2. Specify NoC Constraints in NoC Assignment Editor x
2.1.2.2.1. NoC Assignment Editor Interface Controls
2.2. Constraining Designs with Tcl Scripts x
2.2.1. Create a Project and Apply Constraints 2.2.2. Assigning a Pin 2.2.3. Generating Intel® Quartus® Prime Settings Files 2.2.4. Synopsys* Design Constraint (.sdc) Files 2.2.5. Tcl-only Script Flows
3. Interface Planning x
3.1. Using Interface Planner 3.2. Using Tile Interface Planner 3.3. Interface Planning Revision History
3.1. Using Interface Planner x
3.1.1. Interface Planner User Interface 3.1.2. Interface Planner General Tool Flow 3.1.3. Interface Planner NoC Tool Flow 3.1.4. Interface Planner Reports
3.1.1. Interface Planner User Interface x
3.1.1.1. Flow Controls 3.1.1.2. Home Tab Controls 3.1.1.3. Assignments Tab Controls 3.1.1.4. Plan Tab Controls 3.1.1.5. Reports Tab Controls
3.1.2. Interface Planner General Tool Flow x
3.1.2.1. Step 1: Setup and Synthesize the Project 3.1.2.2. Step 2: Initialize Interface Planner 3.1.2.3. Step 3: Update Plan with Project Assignments 3.1.2.4. Step 4: Plan Periphery Placement 3.1.2.5. Step 5: Report Placement Data 3.1.2.6. Step 6: Validate and Export Plan Constraints
3.1.2.4. Step 4: Plan Periphery Placement x
3.1.2.4.1. Plan Clock Networks 3.1.2.4.2. Saving & Loading Floorplans
3.1.3. Interface Planner NoC Tool Flow x
3.1.3.1. Placing NoC Design Elements Using Interface Planner
3.1.3.1. Placing NoC Design Elements Using Interface Planner x
3.1.3.1.1. Recommended Placement Order for NoC Elements in Interface Planner 3.1.3.1.2. High-Speed Interconnect NoC Locations in Interface Planner
3.1.4. Interface Planner Reports x
3.1.4.1. Report Summary 3.1.4.2. Report Pins 3.1.4.3. Report HSSI Channels 3.1.4.4. Report Clocks 3.1.4.5. Report Periphery Locations 3.1.4.6. Report Cell Connectivity 3.1.4.7. Report Instance Assignments 3.1.4.8. Report NoC Performance
3.2. Using Tile Interface Planner x
3.2.1. Tile Interface Planner Terminology 3.2.2. Tile Interface Planner Tool Flow 3.2.3. Constraining Dynamic Reconfiguration IP 3.2.4. Tile Interface Planner GUI Reference
3.2.2. Tile Interface Planner Tool Flow x
3.2.2.1. Step 1: Instantiate IP and Run Design Analysis 3.2.2.2. Step 2: Initialize Tile Interface Planner 3.2.2.3. Step 3: Update Plan with Project Assignments 3.2.2.4. Step 4: Create a Tile Plan 3.2.2.5. Step 5: Save Tile Plan Assignments 3.2.2.6. Step 6: Run Logic Generation and Design Synthesis
3.2.2.4. Step 4: Create a Tile Plan x
3.2.2.4.1. Placing IP Components 3.2.2.4.2. Constraining IP Building Blocks
3.2.3. Constraining Dynamic Reconfiguration IP x
3.2.3.1. Defining a Dynamic Reconfiguration Group 3.2.3.2. Assigning Dynamic Reconfiguration Group Placement
3.2.4. Tile Interface Planner GUI Reference x
3.2.4.1. Flow Controls 3.2.4.2. Home Tab 3.2.4.3. Assignments Tab Controls 3.2.4.4. Plan Tab Controls 3.2.4.5. Tcl Console Window
3.2.4.4. Plan Tab Controls x
3.2.4.4.1. Design Tree and Filters 3.2.4.4.2. Reconfiguration Groups View 3.2.4.4.3. Legal Locations Pane
4. Managing Device I/O Pins x
4.1. I/O Planning Overview 4.2. Assigning I/O Pins 4.3. Importing and Exporting I/O Pin Assignments 4.4. Validating Pin Assignments 4.5. Verifying I/O Timing 4.6. Viewing Routing and Timing Delays 4.7. Scripting API 4.8. Managing Device I/O Pins Revision History
4.1. I/O Planning Overview x
4.1.1. Basic I/O Planning Flow 4.1.2. Integrating PCB Design Tools 4.1.3. Intel Device Terms
4.2. Assigning I/O Pins x
4.2.1. Assigning to Exclusive Pin Groups 4.2.2. Assigning Slew Rate and Drive Strength 4.2.3. Assigning Differential Pins 4.2.4. Entering Pin Assignments with Tcl Commands 4.2.5. Entering Pin Assignments in HDL Code
4.2.3. Assigning Differential Pins x
4.2.3.1. Overriding I/O Placement Rules on Differential Pins
4.2.5. Entering Pin Assignments in HDL Code x
4.2.5.1. Using Low-Level I/O Primitives
4.3. Importing and Exporting I/O Pin Assignments x
4.3.1. Importing and Exporting for PCB Tools 4.3.2. Migrating Assignments to Another Target Device
4.4. Validating Pin Assignments x
4.4.1. I/O Assignment Validation Rules 4.4.2. I/O Assignment Analysis 4.4.3. Understanding I/O Analysis Reports
4.4.2. I/O Assignment Analysis x
4.4.2.1. Early I/O Assignment Analysis Without Design Files 4.4.2.2. I/O Assignment Analysis With Design Files 4.4.2.3. Overriding Default I/O Pin Analysis
4.5. Verifying I/O Timing x
4.5.1. Running Advanced I/O Timing 4.5.2. Adjusting I/O Timing and Power with Capacitive Loading
4.5.1. Running Advanced I/O Timing x
4.5.1.1. Board Trace Models 4.5.1.2. Defining the Board Trace Model 4.5.1.3. Modifying the Board Trace Model 4.5.1.4. Specifying Near-End vs Far-End I/O Timing Analysis 4.5.1.5. Advanced I/O Timing Analysis Reports
4.7. Scripting API x
4.7.1. Generate Mapped Netlist 4.7.2. Reserve Pins 4.7.3. Set Location 4.7.4. Exclusive I/O Group 4.7.5. Slew Rate and Current Strength
1. Answers to Top FAQs
2. Constraining Designs
3. Interface Planning
4. Managing Device I/O Pins
5. Intel® Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

4.5.1.1. Board Trace Models

The Intel® Quartus® Prime software provides board trace model templates for various I/O standards.

The following figure shows the template for a 2.5 V I/O standard. This model consists of near-end and far-end board component parameters.

Near-end board trace modeling includes the elements which are close to the device. Far-end modeling includes the elements which are at the receiver end of the link, closer to the receiving device. Board trace model topology is conceptual and does not necessarily match the actual board trace for every component. For example, near-end model parameters can represent device-end discrete termination and breakout traces. Far-end modeling can represent the bulk of the board trace to discrete external memory components, and the far end termination network. You can analyze the same circuit with near-end modeling of the entire board, including memory component termination, and far-end modeling of the actual memory component.

Figure 66. 2.5-V I/O Standard Board Trace Model

The following figure shows the template for the LVDS I/O standard. The far-end capacitance (Cf) represents the external-device or multiple-device capacitive load. If you have multiple devices on the far-end, you must find the equivalent capacitance at the far-end, taking into account all receiver capacitances. The far-end capacitance can be the sum of all the receiver capacitances.

The Intel® Quartus® Prime software models of transmission lines do not consider transmission-line resistance (lossless models). You only need to specify distributed inductance (L) and capacitance (C) values on a per-inch basis, which you can obtain from the PCB vendor or manufacturer, the CAD Design tool, or a signal integrity tool, such as the Mentor Graphics* HyperLynx* software.

Figure 67. LVDS Differential Board Trace Model
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