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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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5.1. FPGA Power Considerations
Each FPGA is constructed of many elements. A design may use all or part of the FPGA at various frequency and toggle rates.
The power dissipation map of an FPGA may vary significantly for different designs and implementations. Various power dissipation maps result in different thermal design parameters; therefore, each design must be analyzed individually and there are no set thermal design parameters such as power dissipation, θJC, or θJB that can be published for a device. You must obtain all the thermal design parameters from the PTC.