Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 9/30/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

4. Power and Thermal Calculator (PTC)

The Power and Thermal Calculator (PTC) calculates the power consumption of an Agilex™ 5 FPGA and generates the thermal parameters needed for a system thermal simulation or evaluation of an existing cooling design solution.

There are two versions of the PTC:

  • A standalone version that you can use without having an actual RTL design. You provide all input to this version manually. The standalone version is essential at the early stages of projects when power and cooling requirements must be determined, and no RTL design is yet available.
  • The Quartus Power Analyzer, which is part of the Quartus® Prime software, can be used for thermal analysis of Agilex™ 5 devices. The power analyzer can perform a thermal analysis of the detailed power map of a compiled design. You should use this version whenever possible, because it provides the most accurate thermal data.

The Quartus Power Analyzer can export a .qptc file, which you can import into the PTC for ease of use and what-if analysis.

The PTC can export a .ptc file which you can import into the PTC for ease of use and faster what-if analysis.

This document assumes the PTC version 23.4. Whenever possible, you should always use the latest version of the PTC, because power models may evolve over time. The status of the power model of a device is shown on the Main tab of the PTC, and is listed as either Preliminary or Final. For more information, refer to:

Intel FPGA Power and Thermal Calculator User Guide.


Section Content
PTC Thermal Tab Parameters
Thermal Analysis with the PTC
PTC Thermal Tab Calculation Options
Thermal Resistances and Low Power Devices
Sensor Temperatures on the PTC Thermal Tab

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