Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 9/30/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

6.4. Example 4: Heat Sink Selection

Consider the following example, where the PTC indicates a cooling solution with ΨCA =3.360.

An online search can identify heat sink solutions to satisfy the cooling requirement. One such solution vendor is Alpha Novatech Ltd. Their web page indicates that parts LPDM45-10BLC or LPDM-45-10BP can meet the requirement.

The thermal resistance of the selected heat sink is about 3.2° C/W at 1.5 m/s airflow. Refer to the heat sink vendor's product data sheet for product details and resistance curve.

(The published data for the heat sink cited in this example is based on a ducted wind tunnel, similar to our example set up.)

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