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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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5.1.2. Static, Dynamic, and Standby Power
A combination of dynamic, static, and standby power determines the total power of an FPGA. However, a better understanding of the types of power can contribute to easier power optimization and improved cooling.
- Static Power, or the leakage power, is a function of process node and temperature. FPGA resource usage has some impact on the static power, but that impact is minimal compared to the effects of temperature.
- Dynamic Power is strictly a function of the resources used and is highly affected by their clock frequencies and toggle rates.
- Standby Power is the power that is consumed without any FPGA activity, and is not a function of temperature. Standby power consumption cannot be reduced by optimizing the design or reducing temperatures.
Note: Static power consumption is not the same for every part. The distribution of static power across a given lot of parts is more like a bell curve, but the PTC reports the highest static power for each part, so the cooling and power system can encompass all parts.