Visible to Intel only — GUID: ebs1699601880718
Ixiasoft
Visible to Intel only — GUID: ebs1699601880718
Ixiasoft
2.2. Inspecting the Boards
Following are the steps to inspect each board:
- Place the board on an anti-static surface and inspect it to ensure that it has not been damaged during shipment. You may damage the board without proper anti-static handling.
- Verify that components on the boards appear to be in place and intact.
In typical applications with the Cyclone® V GT FPGA development board, a heat sink is not necessary. However, under extreme conditions or for engineering sample silicon, the board might require additional cooling to stay within operating temperature guidelines. The board has two holes near the FPGA that accommodate many different heat sinks, including the Dynatron CHR-152. You can perform power consumption and thermal modeling to determine whether your application requires additional cooling. For information about measuring board and FPGA power in real time. Refer to The Power Monitor section for more details.
For more information about power consumption and thermal modeling, refer to AN 358: Thermal Management for FPGAs.