Intel® Simics® Simulator for Intel® FPGAs: Agilex™ 5 E-Series Virtual Platform User Guide

Download PDF
ID 786901
Date 8/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. About This Document 2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms 3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Agilex™ 5 E-Series HPS Model 5. Supported Use Cases 6. Troubleshooting Issues When Migrating Software from Intel® Simics® to Hardware A. Document Revision History
1. About This Document x
1.1. Terminology 1.2. List of Acronyms
2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms x
2.1. Agilex™ 5 E-Series Universal Virtual Platform
2.1. Agilex™ 5 E-Series Universal Virtual Platform x
2.1.1. Agilex™ 5 E-Series Universal Virtual Platform Overview 2.1.2. Agilex™ 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.1.3. Agilex™ 5 E-Series Virtual Platform Key Capabilities
2.1.1. Agilex™ 5 E-Series Universal Virtual Platform Overview x
2.1.1.1. Agilex™ 5 HPS Component 2.1.1.2. HPS Subsystem Component 2.1.1.3. FPGA Fabric Design 2.1.1.4. qsys_top Component 2.1.1.5. FPGA Component 2.1.1.6. Board Component 2.1.1.7. System Component 2.1.1.8. Target Script
2.1.3. Agilex™ 5 E-Series Virtual Platform Key Capabilities x
2.1.3.1. Boot-To-Operating System Prompt 2.1.3.2. Basic Ethernet 2.1.3.3. CPU Power-On and Boot Core Selection 2.1.3.4. Reset Flow 2.1.3.5. General Purpose I/O (GPIO) Loopback 2.1.3.6. USB Disks Hot-Plug Support 2.1.3.7. On-Chip Memory IP FPGA Fabric Example Design 2.1.3.8. FPGA-to-HPS Bridges 2.1.3.9. Exercising Peripheral Subsystem in FPGA Fabric Design 2.1.3.10. USB Controller Host/Device Mode Configuration 2.1.3.11. B0 Silicon Features Selection
3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models x
3.1. Agilex™ 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components 3.5. Modeling Support Limitations
3.1. Agilex™ 5 E-Series HPS Intel® Simics® Model x
3.1.1. Agilex™ 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Agilex™ 5 E-Series HPS Components 3.1.6. Agilex™ 5 E-Series B0 Features Support
3.2. Virtual Platform HPS Subsystem Components x
3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)
3.3. Virtual Platform qsys_top Components x
3.3.1. FPGA Fabric
3.4. Virtual Platform Board Components x
3.4.1. Marvel EMAC PHY 3.4.2. SD Card Device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console
4. Running a Simulation with the Agilex™ 5 E-Series HPS Model x
4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Agilex™ 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model
1. About This Document
2. Agilex™ 5 E-Series Intel® Simics® Virtual Platforms
3. Agilex™ 5 E-Series Virtual Platform Component Intel® Simics® Models
4. Running a Simulation with the Agilex™ 5 E-Series HPS Model
5. Supported Use Cases
6. Troubleshooting Issues When Migrating Software from Intel® Simics® to Hardware
A. Document Revision History

2.1.1.2. HPS Subsystem Component

The HPS subsystem component corresponds to the model of the module that integrates all components associated with the HPS in the Agilex™ 5 E-Series device. It includes the HPS models, SDM mailbox, and EMIF model. A brief description of the components that integrate the HPS subsystem component is provided in the following table:
Table 4.  Components That Integrate the HPS Subsystem Component
Component Description
HPS Component The HPS component block is described in Agilex 5 HPS Component.
EMIF Component Models an instance of the External Memory Interfaces (EMIF) for HPS Intel FPGA IP.
SDM Component Implements a limited functionality of the Security Device Manager (SDM) allowing servicing messages sent by the HPS component. It also includes the QSPI controller that is shared between SDM and HPS.

This component is implemented as a Python script named sm_ghrd_subsys_hps_comp.py.

Level Two Title