AN 952: Intel® Arria® 10 HDMI 2.1 System Design Guidelines

ID 709310
Date 6/29/2021
Public

A newer version of this document is available. Customers should click here to go to the newest version.

4.1. Enabling PCB panel design

The following guidelines and requirements target general PCB panels. FR4 stack-up can be an option to reduce cost. Otherwise, Rogers or other more advanced materials are also applicable by independently evaluating stack-up requirements based on the attributes below. Rogers is commonly used for better signaling on larger panels.

You must ensure the cables meet HDMI 2.1 certification. HDMI.org provides a list of compliant connectors provider as well as HDMI 2.1 compliant cable. HDMI IP running 12 Gbps FRL is tested with Belkin cables.

Table 2.  Summary of daughtercard PCB general design guidelines
Item Impedance(Z)/Length Type/Stack-up Comment
Trace 90-100 Ω Length matched FR4, microstrip top/bottom layer Keep stack-up targeting 90 Ω; to minimize reflection loss.
Connectors & Cables 95 Ω Surface mount Apply compliant connectors.

Belkin HDMI2.1 cable.

Components 90 Ω Surface mount Reduce void by placement optimization.
Power plane NA

Lowest Z possible

2 layers Partial to full Ground reference; full reference whenever possible.
Ground plane Lowest plane Z NA Full reference for signals.

HDMI 2.1 accommodates both Transition Minimized Differential Signaling (TMDS) and Fixed Rate Link (FRL) modes. TMDS targets support for legacy HDMI devices running on 3 data lanes and 1 clock lane while FRL runs on 4 data lanes.

On the RX, the TMDS clock path shares the FRL data lane. Thus, a fanout buffer is needed to demultiplex/split incoming RX signal to drive both paths to support both TMDS and FRL on the PCB panel with Intel FPGA. At the schematic level, one of the design approaches is to go with external fanout buffer. However, the additional fanout buffer increases system costs. Another option is to use an integrated fanout buffer option with redriver. The redriver is required at the RX side to recover signals at 16dB up to 12 Gbps.

HDMI 2.1 operates up to 12 Gbps with cable loss of up to 16dB. For cost optimization, use the redriver at the transmitter side.

Below is a summary of the redrivers for Intel® Arria® 10.
Table 3.  Redriver loss compensation and attributes
Component

(TI redrivers)

Insertion loss @12 Gbps Z Comment
DS125BR820 10dB 90 Ω TX redriver
DS125MB203 18dB 90 Ω RX redriver, integrated Fanout buffer
Intel recommends trace impedance (Z) target to be in range 90-100 Ω; do not exceed 100 Ω (not considering fabrication tolerance). This ensures best possible reach on both trace length and signal integrity
Figure 2. Daughtercard panel size
Note: The reference design uses FR4 material due to it is low cost.

The daughtercard panel size is small with high speed traces within 10 inches. If you target larger margin and desire for larger panel, you can opt for Meg6 material. Intel recommends a flex cable topology for signals up to 12 Gbps.

For design with 4 layer (SGPS) FR4 stackup, refer below parameters for microstrip/top layer:
Table 4.  FR4 Stack-up Target
Type FR4 Thick (T) um Width (W) um Height (H) um Spacing (S) um Dieletric Constant (Dk)
Zdiff=100 Ω 35 203.2 110 100 4.3
Note: Z target is 90 to 100 Ω
The parameters are illustrated per below:
Figure 3. PCB fabrication Cross-section Attributes