Visible to Intel only — GUID: mcn1398044163899
Ixiasoft
Supply Current and Power Consumption
I/O Pin Leakage Current
Bus Hold Parameters
Series OCT without Calibration Specifications
Series OCT with Calibration at Device Power-Up Specifications
OCT Variation after Calibration at Device Power-Up
Pin Capacitance
Internal Weak Pull-Up Resistor
Hot-Socketing Specifications
Hysteresis Specifications for Schmitt Trigger Input
Single-Ended I/O Standards Specifications
Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications
Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications
Differential SSTL I/O Standards Specifications
Differential HSTL and HSUL I/O Standards Specifications
Differential I/O Standards Specifications
True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications
True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications
Emulated RSDS_E_1R Transmitter Timing Specifications
True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications
True LVDS Transmitter Timing
Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications
LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications
Visible to Intel only — GUID: mcn1398044163899
Ixiasoft
Memory Output Clock Jitter Specifications
Intel® MAX® 10 devices support external memory interfaces up to 303 MHz. The external memory interfaces for Intel® MAX® 10 devices calibrate automatically.
The memory output clock jitter measurements are for 200 consecutive clock cycles.
The clock jitter specification applies to memory output clock pins generated using DDIO circuits clocked by a PLL output routed on a PHY clock network.
DDR3 and LPDDR2 SDRAM memory interfaces are only supported on the fast speed grade device.
Parameter | Symbol | –6 Speed Grade | –7 Speed Grade | Unit | ||
---|---|---|---|---|---|---|
Min | Max | Min | Max | |||
Clock period jitter | tJIT(per) | –127 | 127 | –215 | 215 | ps |
Cycle-to-cycle period jitter | tJIT(cc) | — | 242 | — | 360 | ps |
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