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1. Signal Integrity Analysis with Third-Party Tools
2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
3. Mentor Graphics* PCB Design Tools Support
4. Cadence Board Design Tools Support
5. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides
1.4.1. Elements of an IBIS Model
1.4.2. Creating Accurate IBIS Models
1.4.3. Design Simulation Using the Mentor Graphics* HyperLynx* Software
1.4.4. Configuring LineSim to Use Intel IBIS Models
1.4.5. Integrating Intel IBIS Models into LineSim Simulations
1.4.6. Running and Interpreting LineSim Simulations
1.5.1. Supported Devices and Signaling
1.5.2. Accessing HSPICE Simulation Kits
1.5.3. The Double Counting Problem in HSPICE Simulations
1.5.4. HSPICE Writer Tool Flow
1.5.5. Running an HSPICE Simulation
1.5.6. Interpreting the Results of an Output Simulation
1.5.7. Interpreting the Results of an Input Simulation
1.5.8. Viewing and Interpreting Tabular Simulation Results
1.5.9. Viewing Graphical Simulation Results
1.5.10. Making Design Adjustments Based on HSPICE Simulations
1.5.11. Sample Input for I/O HSPICE Simulation Deck
1.5.12. Sample Output for I/O HSPICE Simulation Deck
1.5.13. Advanced Topics
1.5.4.1. Applying I/O Assignments
1.5.4.2. Enabling HSPICE Writer
1.5.4.3. Enabling HSPICE Writer Using Assignments
1.5.4.4. Naming Conventions for HSPICE Files
1.5.4.5. Invoking HSPICE Writer
1.5.4.6. Invoking HSPICE Writer from the Command Line
1.5.4.7. Customizing Automatically Generated HSPICE Decks
1.5.11.1. Header Comment
1.5.11.2. Simulation Conditions
1.5.11.3. Simulation Options
1.5.11.4. Constant Definition
1.5.11.5. Buffer Netlist
1.5.11.6. Drive Strength
1.5.11.7. I/O Buffer Instantiation
I/O Buffer Instantiation
1.5.11.8. Board Trace and Termination
1.5.11.9. Stimulus Model
1.5.11.10. Simulation Analysis
1.5.12.1. Header Comment
1.5.12.2. Simulation Conditions
1.5.12.3. Simulation Options
1.5.12.4. Constant Definition
1.5.12.5. I/O Buffer Netlist
1.5.12.6. Drive Strength
1.5.12.7. Slew Rate and Delay Chain
1.5.12.8. I/O Buffer Instantiation
1.5.12.9. Board and Trace Termination
1.5.12.10. Double-Counting Compensation Circuitry
1.5.12.11. Simulation Analysis
2.1. Reviewing Intel® Quartus® Prime Software Settings
2.2. Reviewing Device Pin-Out Information in the Fitter Report
2.3. Reviewing Compilation Error and Warning Messages
2.4. Using Additional Intel® Quartus® Prime Software Features
2.5. Using Additional Intel® Quartus® Prime Software Tools
2.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
4.1. Cadence PCB Design Tools Support
4.2. Product Comparison
4.3. FPGA-to-PCB Design Flow
4.4. Setting Up the Intel® Quartus® Prime Software
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software
4.7. Cadence Board Design Tools Support Revision History
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1.5.11.7. I/O Buffer Instantiation
The I/O buffer instantiation block of the simulation SPICE deck instantiates the necessary power supplies and I/O model components that are necessary to simulate the given I/O.
I/O Buffer Instantiation
I/O Buffer Instantiation
* Supply Voltages Settings
.param vcn=3.135
.param vpd=2.97
.param vc=1.15
* Instantiate Power Supplies|
vvcc vcc 0 vc * FPGA core voltage
vvss vss 0 0 * FPGA core ground
vvccn vccn 0 vcn * IO supply voltage
vvssn vssn 0 0 * IO ground
vvccpd vccpd 0 vpd * Pre-drive supply voltage
* Instantiate I/O Buffer
xvio_buf din oeb opdrain die rambh
+ rpcdn4 rpcdn3 rpcdn2 rpcdn1 rpcdn0
+ rpcdp5 rpcdp4 rpcdp3 rpcdp2 rpcdp1 rpcdp0
+ rpullup vccn vccpd vcpad0 vio_buf
* Internal Loading on Pad
* - No loading on this pad due to differential buffer/support
* circuitry
* I/O Buffer Package Model
* - Single-ended I/O standard on a Row I/O
.lib ‘lib/package.lib’ hio
xpkg die pin hio_pkg