Intel® Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 11/04/2020
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Document Table of Contents
Document Table of Contents x
1. Signal Integrity Analysis with Third-Party Tools 2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software 3. Mentor Graphics* PCB Design Tools Support 4. Cadence Board Design Tools Support 5. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
1. Signal Integrity Analysis with Third-Party Tools x
1.1. Signal Integrity Analysis with Third-Party Tools 1.2. I/O Model Selection: IBIS or HSPICE 1.3. FPGA to Board Signal Integrity Analysis Flow 1.4. Simulation with IBIS Models 1.5. Simulation with HSPICE Models 1.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
1.1. Signal Integrity Analysis with Third-Party Tools x
1.1.1. Signal Integrity Simulations with HSPICE and IBIS Models
1.3. FPGA to Board Signal Integrity Analysis Flow x
1.3.1. Create I/O and Board Trace Model Assignments 1.3.2. Output File Generation 1.3.3. Customize the Output Files 1.3.4. Set Up and Run Simulations in Third-Party Tools 1.3.5. Interpret Simulation Results
1.4. Simulation with IBIS Models x
1.4.1. Elements of an IBIS Model 1.4.2. Creating Accurate IBIS Models 1.4.3. Design Simulation Using the Mentor Graphics* HyperLynx* Software 1.4.4. Configuring LineSim to Use Intel IBIS Models 1.4.5. Integrating Intel IBIS Models into LineSim Simulations 1.4.6. Running and Interpreting LineSim Simulations
1.4.2. Creating Accurate IBIS Models x
1.4.2.1. Download IBIS Models 1.4.2.2. Generate Custom IBIS Models with the IBIS Writer
1.5. Simulation with HSPICE Models x
1.5.1. Supported Devices and Signaling 1.5.2. Accessing HSPICE Simulation Kits 1.5.3. The Double Counting Problem in HSPICE Simulations 1.5.4. HSPICE Writer Tool Flow 1.5.5. Running an HSPICE Simulation 1.5.6. Interpreting the Results of an Output Simulation 1.5.7. Interpreting the Results of an Input Simulation 1.5.8. Viewing and Interpreting Tabular Simulation Results 1.5.9. Viewing Graphical Simulation Results 1.5.10. Making Design Adjustments Based on HSPICE Simulations 1.5.11. Sample Input for I/O HSPICE Simulation Deck 1.5.12. Sample Output for I/O HSPICE Simulation Deck 1.5.13. Advanced Topics
1.5.3. The Double Counting Problem in HSPICE Simulations x
1.5.3.1. Defining the Double Counting Problem 1.5.3.2. The Solution to Double Counting
1.5.4. HSPICE Writer Tool Flow x
1.5.4.1. Applying I/O Assignments 1.5.4.2. Enabling HSPICE Writer 1.5.4.3. Enabling HSPICE Writer Using Assignments 1.5.4.4. Naming Conventions for HSPICE Files 1.5.4.5. Invoking HSPICE Writer 1.5.4.6. Invoking HSPICE Writer from the Command Line 1.5.4.7. Customizing Automatically Generated HSPICE Decks
1.5.11. Sample Input for I/O HSPICE Simulation Deck x
1.5.11.1. Header Comment 1.5.11.2. Simulation Conditions 1.5.11.3. Simulation Options 1.5.11.4. Constant Definition 1.5.11.5. Buffer Netlist 1.5.11.6. Drive Strength 1.5.11.7. I/O Buffer Instantiation 1.5.11.8. Board Trace and Termination 1.5.11.9. Stimulus Model 1.5.11.10. Simulation Analysis
1.5.12. Sample Output for I/O HSPICE Simulation Deck x
1.5.12.1. Header Comment 1.5.12.2. Simulation Conditions 1.5.12.3. Simulation Options 1.5.12.4. Constant Definition 1.5.12.5. I/O Buffer Netlist 1.5.12.6. Drive Strength 1.5.12.7. Slew Rate and Delay Chain 1.5.12.8. I/O Buffer Instantiation 1.5.12.9. Board and Trace Termination 1.5.12.10. Double-Counting Compensation Circuitry 1.5.12.11. Simulation Analysis
1.5.13. Advanced Topics x
1.5.13.1. PVT Simulations 1.5.13.2. Hold Time Analysis 1.5.13.3. I/O Voltage Variations 1.5.13.4. Correlation Report
2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software x
2.1. Reviewing Intel® Quartus® Prime Software Settings 2.2. Reviewing Device Pin-Out Information in the Fitter Report 2.3. Reviewing Compilation Error and Warning Messages 2.4. Using Additional Intel® Quartus® Prime Software Features 2.5. Using Additional Intel® Quartus® Prime Software Tools 2.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
2.1. Reviewing Intel® Quartus® Prime Software Settings x
2.1.1. Device and Pins Options Dialog Box Settings
2.1.1. Device and Pins Options Dialog Box Settings x
2.1.1.1. Configuration Settings 2.1.1.2. Unused Pin Settings 2.1.1.3. Dual-Purpose Pins Settings 2.1.1.4. Voltage Settings 2.1.1.5. Error Detection CRC Settings
2.5. Using Additional Intel® Quartus® Prime Software Tools x
2.5.1. Pin Planner
3. Mentor Graphics* PCB Design Tools Support x
3.1. Integrating with DxDesigner 3.2. Mentor Graphics* PCB Design Tools Support Revision History
3.1. Integrating with DxDesigner x
3.1.1. DxDesigner Project Settings 3.1.2. Creating Schematic Symbols in DxDesigner
4. Cadence Board Design Tools Support x
4.1. Cadence PCB Design Tools Support 4.2. Product Comparison 4.3. FPGA-to-PCB Design Flow 4.4. Setting Up the Intel® Quartus® Prime Software 4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 4.7. Cadence Board Design Tools Support Revision History
4.3. FPGA-to-PCB Design Flow x
4.3.1. Integrating Intel FPGA Designs
4.4. Setting Up the Intel® Quartus® Prime Software x
4.4.1. Generating a .pin File
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
4.5.1. Creating Symbols 4.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
4.5.1. Creating Symbols x
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
4.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 4.5.1.1.2. Import and Export Wizard 4.5.1.1.3. Editing and Fracturing Symbol 4.5.1.1.4. Updating FPGA Symbols
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
4.6.1. Creating a Cadence Allegro Design Entry CIS Project 4.6.2. Generating a Part 4.6.3. Generating Schematic Symbol 4.6.4. Splitting a Part 4.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
4.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
1. Signal Integrity Analysis with Third-Party Tools
2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
3. Mentor Graphics* PCB Design Tools Support
4. Cadence Board Design Tools Support
5. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

1.4.1. Elements of an IBIS Model

An IBIS model file ( .ibs ) is a text file that describes the behavior of an I/O buffer across minimum, typical, and maximum temperature and voltage ranges with a specified test load.

The tables and values specified in the IBIS file describe five basic elements of the I/O buffer.

Figure 2. Five Basic Elements of an I/O Buffer in IBIS Models

The following elements correspond to each numbered block.

  1. Pulldown—A voltage-current table describes the current when the buffer is driven low based on a pull-down voltage range of –VCC to 2 VCC.
  2. Pullup—A voltage-current table describes the current when the buffer is driven high based on a pull-up voltage range of –VCC to VCC.
  3. Ground and Power Clamps—Voltage-current tables describe the current when clamping diodes for electrostatic discharge (ESD) are present. The ground clamp voltage range is –VCC to VCC, and the power clamp voltage range is –VCC to ground.
  4. Ramp and Rising/Falling Waveform—A voltage-time (dv/dt) ratio describes the rise and fall time of the buffer during a logic transition. Optional rising and falling waveform tables can be added to more accurately describe the characteristics of the rising and falling transitions.
  5. Total Output Capacitance and Package RLC—The total output capacitance includes the parasitic capacitances of the output pad, clamp diodes (if present), and input transistors. The package RLC is device package-specific and defines the resistance, inductance, and capacitance of the bond wire and pin of the I/O.
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