Intel® Quartus® Prime Pro Edition User Guide: PCB Design Tools

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ID 683768
Date 11/04/2020
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Document Table of Contents
Document Table of Contents x
1. Signal Integrity Analysis with Third-Party Tools 2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software 3. Mentor Graphics* PCB Design Tools Support 4. Cadence Board Design Tools Support 5. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives A. Intel® Quartus® Prime Pro Edition User Guides
1. Signal Integrity Analysis with Third-Party Tools x
1.1. Signal Integrity Analysis with Third-Party Tools 1.2. I/O Model Selection: IBIS or HSPICE 1.3. FPGA to Board Signal Integrity Analysis Flow 1.4. Simulation with IBIS Models 1.5. Simulation with HSPICE Models 1.6. Signal Integrity Analysis with Third-Party Tools Document Revision History
1.1. Signal Integrity Analysis with Third-Party Tools x
1.1.1. Signal Integrity Simulations with HSPICE and IBIS Models
1.3. FPGA to Board Signal Integrity Analysis Flow x
1.3.1. Create I/O and Board Trace Model Assignments 1.3.2. Output File Generation 1.3.3. Customize the Output Files 1.3.4. Set Up and Run Simulations in Third-Party Tools 1.3.5. Interpret Simulation Results
1.4. Simulation with IBIS Models x
1.4.1. Elements of an IBIS Model 1.4.2. Creating Accurate IBIS Models 1.4.3. Design Simulation Using the Mentor Graphics* HyperLynx* Software 1.4.4. Configuring LineSim to Use Intel IBIS Models 1.4.5. Integrating Intel IBIS Models into LineSim Simulations 1.4.6. Running and Interpreting LineSim Simulations
1.4.2. Creating Accurate IBIS Models x
1.4.2.1. Download IBIS Models 1.4.2.2. Generate Custom IBIS Models with the IBIS Writer
1.5. Simulation with HSPICE Models x
1.5.1. Supported Devices and Signaling 1.5.2. Accessing HSPICE Simulation Kits 1.5.3. The Double Counting Problem in HSPICE Simulations 1.5.4. HSPICE Writer Tool Flow 1.5.5. Running an HSPICE Simulation 1.5.6. Interpreting the Results of an Output Simulation 1.5.7. Interpreting the Results of an Input Simulation 1.5.8. Viewing and Interpreting Tabular Simulation Results 1.5.9. Viewing Graphical Simulation Results 1.5.10. Making Design Adjustments Based on HSPICE Simulations 1.5.11. Sample Input for I/O HSPICE Simulation Deck 1.5.12. Sample Output for I/O HSPICE Simulation Deck 1.5.13. Advanced Topics
1.5.3. The Double Counting Problem in HSPICE Simulations x
1.5.3.1. Defining the Double Counting Problem 1.5.3.2. The Solution to Double Counting
1.5.4. HSPICE Writer Tool Flow x
1.5.4.1. Applying I/O Assignments 1.5.4.2. Enabling HSPICE Writer 1.5.4.3. Enabling HSPICE Writer Using Assignments 1.5.4.4. Naming Conventions for HSPICE Files 1.5.4.5. Invoking HSPICE Writer 1.5.4.6. Invoking HSPICE Writer from the Command Line 1.5.4.7. Customizing Automatically Generated HSPICE Decks
1.5.11. Sample Input for I/O HSPICE Simulation Deck x
1.5.11.1. Header Comment 1.5.11.2. Simulation Conditions 1.5.11.3. Simulation Options 1.5.11.4. Constant Definition 1.5.11.5. Buffer Netlist 1.5.11.6. Drive Strength 1.5.11.7. I/O Buffer Instantiation 1.5.11.8. Board Trace and Termination 1.5.11.9. Stimulus Model 1.5.11.10. Simulation Analysis
1.5.12. Sample Output for I/O HSPICE Simulation Deck x
1.5.12.1. Header Comment 1.5.12.2. Simulation Conditions 1.5.12.3. Simulation Options 1.5.12.4. Constant Definition 1.5.12.5. I/O Buffer Netlist 1.5.12.6. Drive Strength 1.5.12.7. Slew Rate and Delay Chain 1.5.12.8. I/O Buffer Instantiation 1.5.12.9. Board and Trace Termination 1.5.12.10. Double-Counting Compensation Circuitry 1.5.12.11. Simulation Analysis
1.5.13. Advanced Topics x
1.5.13.1. PVT Simulations 1.5.13.2. Hold Time Analysis 1.5.13.3. I/O Voltage Variations 1.5.13.4. Correlation Report
2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software x
2.1. Reviewing Intel® Quartus® Prime Software Settings 2.2. Reviewing Device Pin-Out Information in the Fitter Report 2.3. Reviewing Compilation Error and Warning Messages 2.4. Using Additional Intel® Quartus® Prime Software Features 2.5. Using Additional Intel® Quartus® Prime Software Tools 2.6. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software Revision History
2.1. Reviewing Intel® Quartus® Prime Software Settings x
2.1.1. Device and Pins Options Dialog Box Settings
2.1.1. Device and Pins Options Dialog Box Settings x
2.1.1.1. Configuration Settings 2.1.1.2. Unused Pin Settings 2.1.1.3. Dual-Purpose Pins Settings 2.1.1.4. Voltage Settings 2.1.1.5. Error Detection CRC Settings
2.5. Using Additional Intel® Quartus® Prime Software Tools x
2.5.1. Pin Planner
3. Mentor Graphics* PCB Design Tools Support x
3.1. Integrating with DxDesigner 3.2. Mentor Graphics* PCB Design Tools Support Revision History
3.1. Integrating with DxDesigner x
3.1.1. DxDesigner Project Settings 3.1.2. Creating Schematic Symbols in DxDesigner
4. Cadence Board Design Tools Support x
4.1. Cadence PCB Design Tools Support 4.2. Product Comparison 4.3. FPGA-to-PCB Design Flow 4.4. Setting Up the Intel® Quartus® Prime Software 4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software 4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software 4.7. Cadence Board Design Tools Support Revision History
4.3. FPGA-to-PCB Design Flow x
4.3.1. Integrating Intel FPGA Designs
4.4. Setting Up the Intel® Quartus® Prime Software x
4.4.1. Generating a .pin File
4.5. FPGA-to-Board Integration with the Cadence Allegro Design Entry HDL Software x
4.5.1. Creating Symbols 4.5.2. Instantiating the Symbol in the Cadence Allegro Design Entry HDL Software
4.5.1. Creating Symbols x
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool
4.5.1.1. Cadence Allegro PCB Librarian Part Developer Tool x
4.5.1.1.1. Cadence Allegro PCB Librarian Part Developer Tool in the Design Flow 4.5.1.1.2. Import and Export Wizard 4.5.1.1.3. Editing and Fracturing Symbol 4.5.1.1.4. Updating FPGA Symbols
4.6. FPGA-to-Board Integration with Cadence Allegro Design Entry CIS Software x
4.6.1. Creating a Cadence Allegro Design Entry CIS Project 4.6.2. Generating a Part 4.6.3. Generating Schematic Symbol 4.6.4. Splitting a Part 4.6.5. Instantiating a Symbol in a Design Entry CIS Schematic 4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software
4.6.6. Intel Libraries for the Cadence Allegro Design Entry CIS Software x
4.6.6.1. Using the Intel-provided Libraries with your Cadence Allegro Design Entry CIS Project
1. Signal Integrity Analysis with Third-Party Tools
2. Reviewing Printed Circuit Board Schematics with the Intel® Quartus® Prime Software
3. Mentor Graphics* PCB Design Tools Support
4. Cadence Board Design Tools Support
5. Intel Quartus Prime Pro Edition User Guide: PCB Design Tools Document Archives
A. Intel® Quartus® Prime Pro Edition User Guides

1.4.2.1. Download IBIS Models

Intel provides IBIS models for almost all FPGA and FPGA configuration devices. You can use the IBIS models from the website to perform early simulations of the I/O buffers you expect to use in your design as part of a pre-layout analysis.

Downloaded IBIS models have the RLC package values set to one particular device in each device family.

The .ibs file can be customized for your device package and can be used for any simulation. IBIS models downloaded and used for simulations in this manner are generic. They describe only a certain set of models listed for each device on the Intel IBIS Models page of the Intel website. To create customized models for your design, use the IBIS Writer as described in the next section.

To simulate your design with the model accurately, you must adjust the RLC values in the IBIS model file to match the values for your particular device package by performing the following steps:

  1. Download and expand the ZIP file (.zip) of the IBIS model for the device family you are using for your design. The .zip file contains the .ibs file along with an IBIS model user guide and a model data correlation report.
  2. Download the Package RLC Values spreadsheet for the same device family.
  3. Open the spreadsheet and locate the row that describes the device package used in your design.
  4. From the package’s I/O row, copy the minimum, maximum, and typical values of resistance, inductance, and capacitance for your device package.
  5. Open the .ibs file in a text editor and locate the [Package] section of the file.
  6. Overwrite the listed values copied with the values from the spreadsheet and save the file.
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